Novel thin film polymer foaming technique for low and ultra low-k dielectrics

B. Krause, G.H. Koops, N.F.A. van der Vegt, Matthias Wessling, M. Wubbenhorst, J. van Turnhout

Research output: Contribution to conferencePaper

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The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids
Original languageUndefined
Publication statusPublished - 2001
Event7th IEEE International Conference on Solid Dielectrics, ICSD - Eindhoven, The Netherlands
Duration: 25 Jun 200129 Jun 2001


Conference7th IEEE International Conference on Solid Dielectrics, ICSD
Other25-29 June 2001


  • IR-55919

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