Novel thin film polymer foaming technique for low and ultra low-k dielectrics

B. Krause; G.H. Koops; N.F.A. van der Vegt; Matthias Wessling; M. Wubbenhorst; J. van Turnhout

doi:10.1109/ICSD.2001.955585

Novel thin film polymer foaming technique for low and ultra low-k dielectrics

B. Krause, G.H. Koops, N.F.A. van der Vegt, Matthias Wessling, M. Wubbenhorst, J. van Turnhout

Research output: Contribution to conference › Paper

6 Citations (Scopus)

174 Downloads (Pure)

Abstract

The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids

Original language	Undefined
Pages	187-190
DOIs	https://doi.org/10.1109/ICSD.2001.955585
Publication status	Published - 2001
Event	7th IEEE International Conference on Solid Dielectrics, ICSD - Eindhoven, The Netherlands Duration: 25 Jun 2001 → 29 Jun 2001

Conference

Conference	7th IEEE International Conference on Solid Dielectrics, ICSD
Period	25/06/01 → 29/06/01
Other	25-29 June 2001

Keywords

IR-55919

Access to Document

10.1109/ICSD.2001.955585

00955585

Cite this

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title = "Novel thin film polymer foaming technique for low and ultra low-k dielectrics",

abstract = "The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and {"}non-exotic{"} (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids",

keywords = "IR-55919",

author = "B. Krause and G.H. Koops and {van der Vegt}, N.F.A. and Matthias Wessling and M. Wubbenhorst and {van Turnhout}, J.",

year = "2001",

doi = "10.1109/ICSD.2001.955585",

language = "Undefined",

pages = "187--190",

note = "7th IEEE International Conference on Solid Dielectrics, ICSD ; Conference date: 25-06-2001 Through 29-06-2001",

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TY - CONF

T1 - Novel thin film polymer foaming technique for low and ultra low-k dielectrics

AU - Krause, B.

AU - Koops, G.H.

AU - van der Vegt, N.F.A.

AU - Wessling, Matthias

AU - Wubbenhorst, M.

AU - van Turnhout, J.

PY - 2001

Y1 - 2001

N2 - The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids

AB - The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids

KW - IR-55919

U2 - 10.1109/ICSD.2001.955585

DO - 10.1109/ICSD.2001.955585

M3 - Paper

SP - 187

EP - 190

T2 - 7th IEEE International Conference on Solid Dielectrics, ICSD

Y2 - 25 June 2001 through 29 June 2001

ER -