Novel thin film polymer foaming technique for low and ultra low-k dielectrics

B. Krause, G.H. Koops, N.F.A. van der Vegt, Matthias Wessling, M. Wubbenhorst, J. van Turnhout

Research output: Contribution to conferencePaperAcademic

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75 Downloads (Pure)

Abstract

The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids
Original languageUndefined
Pages187-190
DOIs
Publication statusPublished - 2001
Event7th IEEE International Conference on Solid Dielectrics, ICSD - Eindhoven, The Netherlands
Duration: 25 Jun 200129 Jun 2001

Conference

Conference7th IEEE International Conference on Solid Dielectrics, ICSD
Period25/06/0129/06/01
Other25-29 June 2001

Keywords

  • IR-55919

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