Abstract
The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids
Original language | Undefined |
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Pages | 187-190 |
DOIs | |
Publication status | Published - 2001 |
Event | 7th IEEE International Conference on Solid Dielectrics, ICSD - Eindhoven, The Netherlands Duration: 25 Jun 2001 → 29 Jun 2001 |
Conference
Conference | 7th IEEE International Conference on Solid Dielectrics, ICSD |
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Period | 25/06/01 → 29/06/01 |
Other | 25-29 June 2001 |
Keywords
- IR-55919