Oblique evaporation of Co80Ni20 : Part I: Fixed angle of vapour incidence

Leon Abelmann, Peter ten Berge, Cock Lodder, Theo Popma

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    Abstract

    This paper discusses the effect of an increase in layer thickness (from 40 nm to 1.7 μm) and an increase in deposition rate (from 0.5 to 20 nms-1) on the structure and magnetic properties of Co80Ni20 thin films deposited at incidence angles between 70° and 80° (with respect to the substrate normal). The coercivity and anisotropy increase and the anisotropy in electric resistance decreases with increasing layer thickness up to a thickness of 150 nm. In all samples strong stripe domain structures were observed. The equilibrium domain period increases with increasing layer thickness. An increase in rate of evaporation from 0.5 to 20 nms-1 increases coercivity and anisotropy.
    Original languageEnglish
    Pages (from-to)291-294
    Number of pages4
    JournalJournal of the Magnetics Society of Japan
    Volume18
    Issue numberSuppl. 1
    DOIs
    Publication statusPublished - 1994
    Event3rd Perpendicular Magnetic Recording Conference, PMRC 1994 - Tokyo, Japan
    Duration: 11 Oct 199413 Oct 1994
    Conference number: 3

    Keywords

    • SMI-TST: From 2006 in EWI-TST
    • SMI-MAT: MATERIALS

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