Oblique evaporation of Co₈₀Ni₂₀ : Part I: Fixed angle of vapour incidence

This paper discusses the effect of an increase in layer thickness (from 40 nm to 1.7 μm) and an increase in deposition rate (from 0.5 to 20 nms^-1) on the structure and magnetic properties of Co₈₀Ni₂₀ thin films deposited at incidence angles between 70° and 80° (with respect to the substrate normal). The coercivity and anisotropy increase and the anisotropy in electric resistance decreases with increasing layer thickness up to a thickness of 150 nm. In all samples strong stripe domain structures were observed. The equilibrium domain period increases with increasing layer thickness. An increase in rate of evaporation from 0.5 to 20 nms^-1 increases coercivity and anisotropy.