On-chip decoupling zone for package-stress reduction

V.L. Spiering, S. Bouwstra, R.M.E.J. Spiering, M. Elwenspoek

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    14 Citations (Scopus)
    103 Downloads (Pure)


    The authors report the reduction of package stresses by introducing a decoupling zone directly around a sensor structure. Different geometries of the decoupling zones are compared, using the finite element method (FEM) and analytical models. Reduction factors over 1000 and higher can be realized by using an axisymmetrical V-corrugation. A design rule to optimize the reduction for the V-corrugation is given. This rule is based on analytical calculations and verified by FEM-simulations. Finally, it is shown that the thickness of a backplate, mounted to the sensor chip, can be optimized for minimal thermal stresses in the sensor.
    Original languageEnglish
    Title of host publicationTRANSDUCERS '91
    Subtitle of host publication1991 International Conference on Solid-State Sensors and Actuators
    Place of PublicationPiscataway, NJ
    Number of pages4
    ISBN (Print)0-87942-585-7
    Publication statusPublished - 24 Jun 1991
    Event1991 International Conference on Solid-State Sensors and Actuators, TRANSDUCERS 1991 - San Francisco, United States
    Duration: 24 Jun 199127 Jun 1991


    Conference1991 International Conference on Solid-State Sensors and Actuators, TRANSDUCERS 1991
    Abbreviated titleTRANSDUCERS '91
    Country/TerritoryUnited States
    CitySan Francisco


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