On-chip decoupling zone for package-stress reduction

V.L. Spiering, S. Bouwstra, R.M.E.J. Spiering, M. Elwenspoek

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    12 Citations (Scopus)
    57 Downloads (Pure)

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    Engineering & Materials Science