TY - JOUR
T1 - On chip decoupling zone for package-stress reduction
AU - Spiering, Vincent L.
AU - Bouwstra, Siebe
AU - Spiering, Ruud M.E.J.
PY - 1993
Y1 - 1993
N2 - A mathematical analysis is presented of the reduction of package stresses by introducing an on-chip decoupling zone. Different configurations of the zones are compared, using the finite-element method (FEM) and analytical models. A reduction of several orders of magnitude is obtained when a deep and thin axisymmetrical corrugation with a V-shaped cross section (a V-zone) is applied as the decoupling zone. Approximate expressions for the stiffness and the force reduction are derived. The application of a membrane pressure sensor with a V-zone as decoupling zone is evaluated. It is shown that the sensitivity of the sensor is not reduced by the addition of the V-zone.
AB - A mathematical analysis is presented of the reduction of package stresses by introducing an on-chip decoupling zone. Different configurations of the zones are compared, using the finite-element method (FEM) and analytical models. A reduction of several orders of magnitude is obtained when a deep and thin axisymmetrical corrugation with a V-shaped cross section (a V-zone) is applied as the decoupling zone. Approximate expressions for the stiffness and the force reduction are derived. The application of a membrane pressure sensor with a V-zone as decoupling zone is evaluated. It is shown that the sensitivity of the sensor is not reduced by the addition of the V-zone.
U2 - 10.1016/0924-4247(93)80212-Y
DO - 10.1016/0924-4247(93)80212-Y
M3 - Article
SN - 0924-4247
VL - 39
SP - 149
EP - 157
JO - Sensors and Actuators A: Physical
JF - Sensors and Actuators A: Physical
IS - 2
ER -