On the electromechanical behaviour of thin perforated backplates

M. Pedersen; Wouter Olthuis; Piet Bergveld

On the electromechanical behaviour of thin perforated backplates

M. Pedersen, Wouter Olthuis, Piet Bergveld

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

3 Citations (Scopus)

94 Downloads (Pure)

Abstract

In this work an alternative approach to the modelling of plates with a large number of holes, is presented. By means of plate theory, it is shown that perforated plates can be modelled by conventional orthotropic plates with modified elastic properties. The modification of the elastic constants is derived by equalising the strain-energy of the perforated and the orthotropic plate. The model obtained is then compared with previous methods and applied in the electromechanical simulation of a silicon micromachined microphone structure. The microphone structures are simulated numerically, using an algoritbm based on finite differences.

Original language	Undefined
Title of host publication	Transducers '95
Place of Publication	Stockholm, Sweden
Publisher	IEEE
Pages	234A7-13-234A7-16
Number of pages	4
Publication status	Published - 9 Jan 1995
Event	Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors - Stockholm, Sweden Duration: 25 Jun 1995 → 29 Jun 1995 Conference number: 9

Publication series

Name
Publisher	IEEE
Volume	2

Conference

Conference	Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors
Country/Territory	Sweden
City	Stockholm
Period	25/06/95 → 29/06/95

Keywords

IR-16890
METIS-113775

Access to Document

00721732

Cite this

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title = "On the electromechanical behaviour of thin perforated backplates",

abstract = "In this work an alternative approach to the modelling of plates with a large number of holes, is presented. By means of plate theory, it is shown that perforated plates can be modelled by conventional orthotropic plates with modified elastic properties. The modification of the elastic constants is derived by equalising the strain-energy of the perforated and the orthotropic plate. The model obtained is then compared with previous methods and applied in the electromechanical simulation of a silicon micromachined microphone structure. The microphone structures are simulated numerically, using an algoritbm based on finite differences.",

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publisher = "IEEE",

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T1 - On the electromechanical behaviour of thin perforated backplates

AU - Pedersen, M.

AU - Olthuis, Wouter

AU - Bergveld, Piet

N1 - Conference code: 9

PY - 1995/1/9

Y1 - 1995/1/9

N2 - In this work an alternative approach to the modelling of plates with a large number of holes, is presented. By means of plate theory, it is shown that perforated plates can be modelled by conventional orthotropic plates with modified elastic properties. The modification of the elastic constants is derived by equalising the strain-energy of the perforated and the orthotropic plate. The model obtained is then compared with previous methods and applied in the electromechanical simulation of a silicon micromachined microphone structure. The microphone structures are simulated numerically, using an algoritbm based on finite differences.

AB - In this work an alternative approach to the modelling of plates with a large number of holes, is presented. By means of plate theory, it is shown that perforated plates can be modelled by conventional orthotropic plates with modified elastic properties. The modification of the elastic constants is derived by equalising the strain-energy of the perforated and the orthotropic plate. The model obtained is then compared with previous methods and applied in the electromechanical simulation of a silicon micromachined microphone structure. The microphone structures are simulated numerically, using an algoritbm based on finite differences.

KW - IR-16890

KW - METIS-113775

M3 - Conference contribution

SP - 234A7-13-234A7-16

BT - Transducers '95

PB - IEEE

CY - Stockholm, Sweden

Y2 - 25 June 1995 through 29 June 1995

ER -