Optimal actuator shape design with input and state constraints for a wafer heating application

D. W.M. Veldman, R. H.B. Fey, H. J. Zwart, M. M.J. Van De Wal, J. D.B.J. Van Den Boom, H. Nijmeijer

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review


    Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.

    Original languageEnglish
    Title of host publication2019 American Control Conference, ACC 2019
    Number of pages6
    ISBN (Electronic)978-1-5386-7926-5
    ISBN (Print)978-1-5386-7901-2
    Publication statusPublished - 1 Jul 2019
    EventAmerican Control Conference, ACC 2019 - Philadelphia Marriott Downtown, Philadelphia, United States
    Duration: 10 Jul 201912 Jul 2019


    ConferenceAmerican Control Conference, ACC 2019
    Abbreviated titleACC
    CountryUnited States
    Otherheld in conjunction with the IFAC Symposium on Advances in Control Education (ACE) on July 8-9
    Internet address


    Cite this

    Veldman, D. W. M., Fey, R. H. B., Zwart, H. J., Van De Wal, M. M. J., Van Den Boom, J. D. B. J., & Nijmeijer, H. (2019). Optimal actuator shape design with input and state constraints for a wafer heating application. In 2019 American Control Conference, ACC 2019 (pp. 3789-3794). [8814819] IEEE.