Optimal actuator shape design with input and state constraints for a wafer heating application

D.W.M. Veldman; R. H.B. Fey; H.J. Zwart; M.M.J. van de Wal; J.D.B.J. van den Boom; H. Nijmeijer

doi:10.23919/ACC.2019.8814819

Optimal actuator shape design with input and state constraints for a wafer heating application

D.W.M. Veldman
, R. H.B. Fey
, H.J. Zwart
, M.M.J. van de Wal
, J.D.B.J. van den Boom
, H. Nijmeijer

Hybrid Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

90 Downloads (Pure)

Abstract

Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.

Original language	English
Title of host publication	2019 American Control Conference, ACC 2019
Publisher	IEEE
Pages	3789-3794
Number of pages	6
ISBN (Electronic)	978-1-5386-7926-5
ISBN (Print)	978-1-5386-7901-2
DOIs	https://doi.org/10.23919/ACC.2019.8814819
Publication status	Published - 1 Jul 2019
Event	American Control Conference, ACC 2019 - Philadelphia Marriott Downtown, Philadelphia, United States Duration: 10 Jul 2019 → 12 Jul 2019 http://acc2019.a2c2.org/

Conference

Conference	American Control Conference, ACC 2019
Abbreviated title	ACC
Country/Territory	United States
City	Philadelphia
Period	10/07/19 → 12/07/19
Other	held in conjunction with the IFAC Symposium on Advances in Control Education (ACE) on July 8-9
Internet address	http://acc2019.a2c2.org/

Keywords

2023 OA procedure

Access to Document

10.23919/ACC.2019.8814819

ArticleFinal published version, 422 KBLicence: Taverne

Cite this

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title = "Optimal actuator shape design with input and state constraints for a wafer heating application",

abstract = "Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.",

keywords = "2023 OA procedure",

author = "D.W.M. Veldman and Fey, \{R. H.B.\} and H.J. Zwart and \{van de Wal\}, M.M.J. and \{van den Boom\}, J.D.B.J. and H. Nijmeijer",

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doi = "10.23919/ACC.2019.8814819",

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note = "American Control Conference, ACC 2019, ACC ; Conference date: 10-07-2019 Through 12-07-2019",

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}

Veldman, DWM, Fey, RHB, Zwart, HJ, van de Wal, MMJ, van den Boom, JDBJ & Nijmeijer, H 2019, Optimal actuator shape design with input and state constraints for a wafer heating application. in 2019 American Control Conference, ACC 2019., 8814819, IEEE, pp. 3789-3794, American Control Conference, ACC 2019, Philadelphia, Pennsylvania, United States, 10/07/19. https://doi.org/10.23919/ACC.2019.8814819

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AU - Veldman, D.W.M.

AU - Fey, R. H.B.

AU - Zwart, H.J.

AU - van de Wal, M.M.J.

AU - van den Boom, J.D.B.J.

AU - Nijmeijer, H.

PY - 2019/7/1

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N2 - Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.

AB - Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.

KW - 2023 OA procedure

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U2 - 10.23919/ACC.2019.8814819

DO - 10.23919/ACC.2019.8814819

M3 - Conference contribution

AN - SCOPUS:85072269084

SN - 978-1-5386-7901-2

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BT - 2019 American Control Conference, ACC 2019

PB - IEEE

T2 - American Control Conference, ACC 2019

Y2 - 10 July 2019 through 12 July 2019

ER -

Optimal actuator shape design with input and state constraints for a wafer heating application

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