Optimized Deep UV hardbake process for metal-free dry-etching of integrated optical devices

G. Sengo, Hendricus A.G.M. van Wolferen, Kerstin Worhoff, A. Driessen

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Abstract

Photostabilization is a widely used post lithographic resist treatment process, which allows hardening the resist profile in order to maintain critical dimensions and to increase selectivity in subsequent process steps such as reactive ion etching. In this paper we present the optimization of Deep UV-curing of 0,3-3.5 μm thick positive resist profiles followed by heat treatment up to 280 0C. The effectiveness of this resist treatment allows for metal mask free reactive ion etching with selectivity up to 6 for silicon structures, thermal silicon oxide and silicon oxynitride. A number of experimental results on integrated optics structures are presented that demonstrate the improved etch profiles obtained with this approach.
Original languageEnglish
Title of host publicationProceedings European Conference on Integrated Optics (ECIO 2007)
Place of PublicationCopenhagen
PublisherTechnical University Denmark
PagesThG 05-THG 05/1
Number of pages4
ISBN (Print)not assigned
Publication statusPublished - Apr 2007
Event13th European Conference on Integrated Optics, ECIO 2007 - Copenhagen, Netherlands
Duration: 25 Apr 200727 Apr 2007
Conference number: 13

Publication series

Name
PublisherTechnical University Denmark
NumberLNCS4549

Conference

Conference13th European Conference on Integrated Optics, ECIO 2007
Abbreviated titleECIO
CountryNetherlands
CityCopenhagen
Period25/04/0727/04/07

Fingerprint

etching
profiles
selectivity
metals
oxynitrides
integrated optics
silicon
curing
silicon oxides
hardening
ions
heat treatment
masks
optimization

Keywords

  • IOMS-APD: Active Photonic Devices
  • IOMS-PIT: PHOTONICS INTEGRATION TECHNOLOGY
  • IR-64361
  • METIS-241925
  • EWI-11101

Cite this

Sengo, G., van Wolferen, H. A. G. M., Worhoff, K., & Driessen, A. (2007). Optimized Deep UV hardbake process for metal-free dry-etching of integrated optical devices. In Proceedings European Conference on Integrated Optics (ECIO 2007) (pp. ThG 05-THG 05/1). Copenhagen: Technical University Denmark.
Sengo, G. ; van Wolferen, Hendricus A.G.M. ; Worhoff, Kerstin ; Driessen, A. / Optimized Deep UV hardbake process for metal-free dry-etching of integrated optical devices. Proceedings European Conference on Integrated Optics (ECIO 2007). Copenhagen : Technical University Denmark, 2007. pp. ThG 05-THG 05/1
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title = "Optimized Deep UV hardbake process for metal-free dry-etching of integrated optical devices",
abstract = "Photostabilization is a widely used post lithographic resist treatment process, which allows hardening the resist profile in order to maintain critical dimensions and to increase selectivity in subsequent process steps such as reactive ion etching. In this paper we present the optimization of Deep UV-curing of 0,3-3.5 μm thick positive resist profiles followed by heat treatment up to 280 0C. The effectiveness of this resist treatment allows for metal mask free reactive ion etching with selectivity up to 6 for silicon structures, thermal silicon oxide and silicon oxynitride. A number of experimental results on integrated optics structures are presented that demonstrate the improved etch profiles obtained with this approach.",
keywords = "IOMS-APD: Active Photonic Devices, IOMS-PIT: PHOTONICS INTEGRATION TECHNOLOGY, IR-64361, METIS-241925, EWI-11101",
author = "G. Sengo and {van Wolferen}, {Hendricus A.G.M.} and Kerstin Worhoff and A. Driessen",
year = "2007",
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language = "English",
isbn = "not assigned",
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}

Sengo, G, van Wolferen, HAGM, Worhoff, K & Driessen, A 2007, Optimized Deep UV hardbake process for metal-free dry-etching of integrated optical devices. in Proceedings European Conference on Integrated Optics (ECIO 2007). Technical University Denmark, Copenhagen, pp. ThG 05-THG 05/1, 13th European Conference on Integrated Optics, ECIO 2007, Copenhagen, Netherlands, 25/04/07.

Optimized Deep UV hardbake process for metal-free dry-etching of integrated optical devices. / Sengo, G.; van Wolferen, Hendricus A.G.M.; Worhoff, Kerstin; Driessen, A.

Proceedings European Conference on Integrated Optics (ECIO 2007). Copenhagen : Technical University Denmark, 2007. p. ThG 05-THG 05/1.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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T1 - Optimized Deep UV hardbake process for metal-free dry-etching of integrated optical devices

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AU - Worhoff, Kerstin

AU - Driessen, A.

PY - 2007/4

Y1 - 2007/4

N2 - Photostabilization is a widely used post lithographic resist treatment process, which allows hardening the resist profile in order to maintain critical dimensions and to increase selectivity in subsequent process steps such as reactive ion etching. In this paper we present the optimization of Deep UV-curing of 0,3-3.5 μm thick positive resist profiles followed by heat treatment up to 280 0C. The effectiveness of this resist treatment allows for metal mask free reactive ion etching with selectivity up to 6 for silicon structures, thermal silicon oxide and silicon oxynitride. A number of experimental results on integrated optics structures are presented that demonstrate the improved etch profiles obtained with this approach.

AB - Photostabilization is a widely used post lithographic resist treatment process, which allows hardening the resist profile in order to maintain critical dimensions and to increase selectivity in subsequent process steps such as reactive ion etching. In this paper we present the optimization of Deep UV-curing of 0,3-3.5 μm thick positive resist profiles followed by heat treatment up to 280 0C. The effectiveness of this resist treatment allows for metal mask free reactive ion etching with selectivity up to 6 for silicon structures, thermal silicon oxide and silicon oxynitride. A number of experimental results on integrated optics structures are presented that demonstrate the improved etch profiles obtained with this approach.

KW - IOMS-APD: Active Photonic Devices

KW - IOMS-PIT: PHOTONICS INTEGRATION TECHNOLOGY

KW - IR-64361

KW - METIS-241925

KW - EWI-11101

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BT - Proceedings European Conference on Integrated Optics (ECIO 2007)

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Sengo G, van Wolferen HAGM, Worhoff K, Driessen A. Optimized Deep UV hardbake process for metal-free dry-etching of integrated optical devices. In Proceedings European Conference on Integrated Optics (ECIO 2007). Copenhagen: Technical University Denmark. 2007. p. ThG 05-THG 05/1