Overview of signal integrity and EMC design technologies on PCB: fundamentals and latest progress

Tzong-Lin Wu, Frederik Johannes Karel Buesink, Flavio Canavero

    Research output: Contribution to journalArticleAcademicpeer-review

    121 Citations (Scopus)

    Abstract

    This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.
    Original languageUndefined
    Pages (from-to)624-638
    Number of pages15
    JournalIEEE transactions on electromagnetic compatibility
    Volume55
    Issue number4
    DOIs
    Publication statusPublished - 1 May 2013

    Keywords

    • EWI-23760
    • IR-87344
    • METIS-300032

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