Package stress reduction and low initial stress thanks to deep corrugations

V.L. Spiering, J.F. Burger, M.C. Elwenspoek, S. Bouwstra

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationTransducers '93
Subtitle of host publicationpapers presented at the 7th International Conference on Solid-State Sensors and Actuators, Yokohama, Japan, June 7-10, 1993
Pages44-45
Publication statusPublished - 7 Oct 1993
Event7th International Conference on Solid-State Sensors and Actuators, Transducers 1993 - Yokohama, Japan
Duration: 7 Jun 199310 Jun 1993

Conference

Conference7th International Conference on Solid-State Sensors and Actuators, Transducers 1993
Period7/06/9310/06/93
OtherJune 7-10, 1993

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