Package stress reduction and low initial stress thanks to deep corrugations

V.L. Spiering; J.F. Burger; M.C. Elwenspoek; S. Bouwstra

Package stress reduction and low initial stress thanks to deep corrugations

V.L. Spiering, J.F. Burger, M.C. Elwenspoek, S. Bouwstra

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Transducers '93
Subtitle of host publication	papers presented at the 7th International Conference on Solid-State Sensors and Actuators, Yokohama, Japan, June 7-10, 1993
Pages	44-45
Publication status	Published - 7 Oct 1993
Event	7th International Conference on Solid-State Sensors and Actuators, Transducers 1993 - Yokohama, Japan Duration: 7 Jun 1993 → 10 Jun 1993

Conference

Conference	7th International Conference on Solid-State Sensors and Actuators, Transducers 1993
Period	7/06/93 → 10/06/93
Other	June 7-10, 1993

Cite this

@inproceedings{9bd00f4fec0d48c189ba4465bb68e33c,

title = "Package stress reduction and low initial stress thanks to deep corrugations",

author = "V.L. Spiering and J.F. Burger and M.C. Elwenspoek and S. Bouwstra",

year = "1993",

month = oct,

day = "7",

language = "English",

pages = "44--45",

booktitle = "Transducers '93",

note = "7th International Conference on Solid-State Sensors and Actuators, Transducers 1993 ; Conference date: 07-06-1993 Through 10-06-1993",

}

Spiering, VL, Burger, JF, Elwenspoek, MC & Bouwstra, S 1993, Package stress reduction and low initial stress thanks to deep corrugations. in Transducers '93: papers presented at the 7th International Conference on Solid-State Sensors and Actuators, Yokohama, Japan, June 7-10, 1993. pp. 44-45, 7th International Conference on Solid-State Sensors and Actuators, Transducers 1993, 7/06/93.

Package stress reduction and low initial stress thanks to deep corrugations. / Spiering, V.L.; Burger, J.F.; Elwenspoek, M.C. et al.
Transducers '93: papers presented at the 7th International Conference on Solid-State Sensors and Actuators, Yokohama, Japan, June 7-10, 1993. 1993. p. 44-45.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Package stress reduction and low initial stress thanks to deep corrugations

AU - Spiering, V.L.

AU - Burger, J.F.

AU - Elwenspoek, M.C.

AU - Bouwstra, S.

PY - 1993/10/7

Y1 - 1993/10/7

M3 - Conference contribution

SP - 44

EP - 45

BT - Transducers '93

T2 - 7th International Conference on Solid-State Sensors and Actuators, Transducers 1993

Y2 - 7 June 1993 through 10 June 1993

ER -