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Parasitics Analysis in the Power and Gate Driver Loops and Impact on the Ringing of SiC MOSFETs

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Abstract

This paper analyzes the behavior of transient switching silicon carbide devices influenced by the parasitics of printed circuit board and the component itself. The parasitics in power and gate driver loops are described and investigated. Double pulse test simulations for silicon carbide devices are conducted in this report and verified through the circuit simulation. The parasitics in the printed circuit board are added based on the real experience printed circuit board design and the parasitics in silicon carbide devices are added based on the manufacturer modelling. The parasitic inductances in the simulation are varied 30% to understand the effect of the parasitics. The drain and source parasitic inductances and the gate parasitic resistance are simulated separately to understand the individual effect on the ringing of silicon carbide devices. The ringing impact on the reliability of devices is also analyzed in this paper.

Original languageEnglish
Title of host publicationProceedings 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2021
Place of PublicationPiscataway, NJ
PublisherIEEE
Number of pages4
ISBN (Electronic)978-1-7281-7621-5
ISBN (Print)978-1-7281-7622-2
DOIs
Publication statusPublished - 16 Nov 2021
Event2021 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2021 - Merusaka Nusa, Nusa Dua, Bali, Indonesia
Duration: 27 Sept 202130 Sept 2021
https://apemc2021.org/

Publication series

NameProceedings Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
PublisherIEEE
Volume2021
ISSN (Print)2162-7673
ISSN (Electronic)2640-7469

Conference

Conference2021 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2021
Abbreviated titleAPEMC
Country/TerritoryIndonesia
CityNusa Dua, Bali
Period27/09/2130/09/21
Internet address

Keywords

  • Parasitics
  • Ringing
  • Silicon carbide (SiC)
  • 22/1 OA procedure

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