Pellicle films supporting the ramp to HVM with EUV

P.J. van Zwol, M. Nasalevich, W. Pim Voorthuijzen, E. Kurganova, A. Notenboom, D.F. Vles, M. Peter, W. Symens, A.J.M. Giesbers, J.H. Klootwijk, R.W.E. van de Kruijs , W.J. van der Zande

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

22 Citations (Scopus)
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EUV pellicles are needed to support EUV lithography in high volume manufacturing. We demonstrate progress in cap layer design for increased EUV transmission and infrared emission of the Polysilicon-film. In our research lab we obtained EUV transmission of 90% and good emissivity for a fully capped pSi film. We also discuss results on next generation EUV pellicle films. These include metal-silicides and graphite. Next-gen film performance is compared to the current generation pSi film. These films are expected to be stable at higher operating temperature than pSi. Metal-silicides have the advantage of sharing a similar process flow as that of pSi, while graphite shows ultimate high temperature performance at the expense of a more complicated manufacturing flow. Capping layers are needed here as well and capping strategies are discussed for these film generations.

Original languageEnglish
Title of host publicationPhotomask Technology 2017
Number of pages9
ISBN (Electronic)9781510613768
Publication statusPublished - 2017
EventSPIE Photomask Technology + EUV Lithography 2017 - Monterey, United States
Duration: 11 Sep 201714 Sep 2017

Publication series

NameProceedings of SPIE


ConferenceSPIE Photomask Technology + EUV Lithography 2017
Country/TerritoryUnited States
Internet address


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