Abstract
A method for making a pellicle for EUV lithography, the method comprising: depositing a sacrificial layer onto a substrate; etching away part of the substrate so as to expose a part of the sacrificial layer; depositing a core layer onto the sacrificial layer, the core layer forming a core part of a membrane of the pellicle once made; and etching away part of the sacrificial layer so as to expose a part of the core layer; wherein the core layer is deposited after the etching of the substrate.
Original language | English |
---|---|
Patent number | CN113646697 |
IPC | G03F 7/ 20 A I |
Priority date | 23/03/20 |
Publication status | Published - 12 Nov 2021 |