Performance of inkjet-printed structures on different substrate materials under high humidity and elevated temperature conditions

N.B. Palacios-Aguilera, Roy Visser, L.D. Vargas-Llona, U. Balda Irurzun, Ashok Sridhar, Remko Akkerman, A. Bossche

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

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Abstract

Inkjet printing is widely being researched as enabling technology for printed electronics; however, there are scarce publications concerning the reliability of inkjet-printed structures on different substrates. The reliability of such structures under high humidity and high temperature conditions is treated in this work. To do so, the adhesion and resistivity of printed structures on PET, Rogers, PI and FR-4 materials are studied before and after a moisture resistance test. The samples present average resistivity values in the range of 12-106 μΩ·cm and only one specimen of the Rogers sample fails the reliability test. The Rogers sample presents perfect adhesion characteristics, the adhesion can be improved for the rest of the samples, especially for the PI sample. The general performance of inkjet-printed structures on different substrate materials is good.
Original languageEnglish
Title of host publication4th Electronic System-Integration Technology Conference (ESTC)
Place of PublicationAmsterdam
PublisherIEEE
Pages-
Publication statusPublished - 17 Sep 2012
Event4th Electronic System-Integration Technology Conference, ESTC 2012 - RAI Conference and Exhibition Centre, Amsterdam, Netherlands
Duration: 17 Sep 201220 Sep 2012
Conference number: 4

Publication series

Name
PublisherIEEE

Conference

Conference4th Electronic System-Integration Technology Conference, ESTC 2012
Abbreviated titleESTC
CountryNetherlands
CityAmsterdam
Period17/09/1220/09/12

Keywords

  • METIS-294471
  • IR-84243

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    Palacios-Aguilera, N. B., Visser, R., Vargas-Llona, L. D., Balda Irurzun, U., Sridhar, A., Akkerman, R., & Bossche, A. (2012). Performance of inkjet-printed structures on different substrate materials under high humidity and elevated temperature conditions. In 4th Electronic System-Integration Technology Conference (ESTC) (pp. -). Amsterdam: IEEE.