Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides

M. Sadej, H. Gojzewski, P. Gajewski, G. J. Vancso, E. Andrzejewska* (Corresponding Author)

*Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

4 Citations (Scopus)
171 Downloads (Pure)

Abstract

Boron nitride (BN) and silicon nitride (Si3N4) are very promising particulate fillers for production of photocurable composites dedicated to thermally conductive and electrically insulating protective coatings. Composites containing crosslinked methacrylate-based matrices filled with BN or Si3N4 (in amounts up to 5 wt%) were prepared in a fast in situ photocuring process with high conversion (>90%). The monomers were polyethylene glycol dimethacrylate and mono-methacrylate (50/50 by weight mixture). Investigations included determination of properties of the monomer/filler compositions, photocuring kinetics and thermal, conductive and mechanical properties of the resulting composites. It was found that addition of the fillers improves polymerization kinetics and mechanical properties compared to the pure polymer matrix. Despite the very low loading level a substantial improvement in thermal conductivity was obtained: a 4-fold increase after addition of only 2 wt% of Si3 N4 and 2.5-fold increase after addition of 0.5 wt% of BN. SEM and AFM imaging (with nanoscopic Young’s modulus determination) revealed good matrix-filler adhesion for the both types of fillers, tendency of the particles to be preferentially located in the bulk rather than at the interface and formation of thermally conducting paths (for the Si3N4 filler).

Original languageEnglish
Pages (from-to)790-807
Number of pages18
JournalExpress polymer letters
Volume12
Issue number9
DOIs
Publication statusPublished - 1 Sep 2018

Fingerprint

Boron nitride
boron nitrides
acrylates
Silicon nitride
fillers
silicon nitrides
Fillers
Thermal conductivity
thermal conductivity
composite materials
Composite materials
Methacrylates
matrices
monomers
Monomers
mechanical properties
Mechanical properties
Kinetics
protective coatings
kinetics

Keywords

  • Boron nitride
  • Photocuring
  • Polymer composites
  • Silicon nitride
  • Acrylates

Cite this

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title = "Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides",
abstract = "Boron nitride (BN) and silicon nitride (Si3N4) are very promising particulate fillers for production of photocurable composites dedicated to thermally conductive and electrically insulating protective coatings. Composites containing crosslinked methacrylate-based matrices filled with BN or Si3N4 (in amounts up to 5 wt{\%}) were prepared in a fast in situ photocuring process with high conversion (>90{\%}). The monomers were polyethylene glycol dimethacrylate and mono-methacrylate (50/50 by weight mixture). Investigations included determination of properties of the monomer/filler compositions, photocuring kinetics and thermal, conductive and mechanical properties of the resulting composites. It was found that addition of the fillers improves polymerization kinetics and mechanical properties compared to the pure polymer matrix. Despite the very low loading level a substantial improvement in thermal conductivity was obtained: a 4-fold increase after addition of only 2 wt{\%} of Si3 N4 and 2.5-fold increase after addition of 0.5 wt{\%} of BN. SEM and AFM imaging (with nanoscopic Young’s modulus determination) revealed good matrix-filler adhesion for the both types of fillers, tendency of the particles to be preferentially located in the bulk rather than at the interface and formation of thermally conducting paths (for the Si3N4 filler).",
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Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides. / Sadej, M.; Gojzewski, H.; Gajewski, P.; Vancso, G. J.; Andrzejewska, E. (Corresponding Author).

In: Express polymer letters, Vol. 12, No. 9, 01.09.2018, p. 790-807.

Research output: Contribution to journalArticleAcademicpeer-review

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AU - Gojzewski, H.

AU - Gajewski, P.

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AU - Andrzejewska, E.

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AB - Boron nitride (BN) and silicon nitride (Si3N4) are very promising particulate fillers for production of photocurable composites dedicated to thermally conductive and electrically insulating protective coatings. Composites containing crosslinked methacrylate-based matrices filled with BN or Si3N4 (in amounts up to 5 wt%) were prepared in a fast in situ photocuring process with high conversion (>90%). The monomers were polyethylene glycol dimethacrylate and mono-methacrylate (50/50 by weight mixture). Investigations included determination of properties of the monomer/filler compositions, photocuring kinetics and thermal, conductive and mechanical properties of the resulting composites. It was found that addition of the fillers improves polymerization kinetics and mechanical properties compared to the pure polymer matrix. Despite the very low loading level a substantial improvement in thermal conductivity was obtained: a 4-fold increase after addition of only 2 wt% of Si3 N4 and 2.5-fold increase after addition of 0.5 wt% of BN. SEM and AFM imaging (with nanoscopic Young’s modulus determination) revealed good matrix-filler adhesion for the both types of fillers, tendency of the particles to be preferentially located in the bulk rather than at the interface and formation of thermally conducting paths (for the Si3N4 filler).

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