Abstract
This paper demonstrates that the performance of natural-convection pin fin heat sinks can be improved up to 16% by actually removing pin fins from a conventional pin fin heat sink. Both numerical and experimental studies are performed on a commercially available pin fin heat sink suspended in mid-air and correlated well. Both natural convection and radiative heat transfer contributions are analysed. The individual contribution of each pin fin is studied, showing that 94% of heat transfer can be attributed to the heat sink baseplate and two outer rings of pin fins. A two-step optimization strategy was devised and applied leading to an optimal design with a thermal resistance of 3.35 K/W, compared to the original 4.0 K/W, for a 10 W heat load. Altogether, the advantages of computational modelling in combination with experimental testing are exploited leading to better, lighter and more cost effective thermal management solutions.
Original language | English |
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Title of host publication | THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems |
Publisher | IEEE |
ISBN (Electronic) | 9781728120782 |
DOIs | |
Publication status | Published - 25 Sept 2019 |
Externally published | Yes |
Event | 25th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2019 - University of Milano, Lecco, Italy Duration: 24 Sept 2020 → 24 Sept 2020 Conference number: 25 https://therminic2019.eu/ |
Workshop
Workshop | 25th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2019 |
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Abbreviated title | THERMINIC |
Country/Territory | Italy |
City | Lecco |
Period | 24/09/20 → 24/09/20 |
Internet address |