PLANAR HEAT PIPE FOR COOLING

Wessel Willems Wits (Inventor), Hendrik Mannak, Jan (Inventor), Rob Legtenberg, (Inventor)

Research output: PatentProfessional

Abstract

There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5), at least one of the panels (1, 2) being grooved (9) on its metal clad side, the panels (1, 2) being assembled by their metal clad sides to form a sealed cavity (8), the cavity (8) being filled with a fluid (10), the fluid (10) circulating by capillary action along the grooves (9) towards zones exposed to heat where it vaporizes.

Original languageEnglish
Patent numberWO2007096313
IPCF28D 15/ 04 A I
Priority date22/02/06
Publication statusPublished - 30 Aug 2007

Fingerprint

Clad metals
Heat pipes
Cooling
Fluids
Printed circuit boards
Hot Temperature

Cite this

Wits, W. W., Mannak, Jan, H., & Legtenberg, R. (2007). IPC No. F28D 15/ 04 A I. PLANAR HEAT PIPE FOR COOLING. (Patent No. WO2007096313).
Wits, Wessel Willems (Inventor) ; Mannak, Jan, Hendrik (Inventor) ; Legtenberg, Rob (Inventor). / PLANAR HEAT PIPE FOR COOLING. IPC No.: F28D 15/ 04 A I. Patent No.: WO2007096313.
@misc{c487977869a8403495b5ca8a14a4241f,
title = "PLANAR HEAT PIPE FOR COOLING",
abstract = "There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5), at least one of the panels (1, 2) being grooved (9) on its metal clad side, the panels (1, 2) being assembled by their metal clad sides to form a sealed cavity (8), the cavity (8) being filled with a fluid (10), the fluid (10) circulating by capillary action along the grooves (9) towards zones exposed to heat where it vaporizes.",
author = "Wits, {Wessel Willems} and {Mannak, Jan}, Hendrik and Rob Legtenberg,",
year = "2007",
month = "8",
day = "30",
language = "English",
type = "Patent",
note = "WO2007096313; F28D 15/ 04 A I",

}

Wits, WW, Mannak, Jan, H & Legtenberg, R 2007, PLANAR HEAT PIPE FOR COOLING, Patent No. WO2007096313, IPC No. F28D 15/ 04 A I.

PLANAR HEAT PIPE FOR COOLING. / Wits, Wessel Willems (Inventor); Mannak, Jan, Hendrik (Inventor); Legtenberg, Rob (Inventor).

IPC No.: F28D 15/ 04 A I. Patent No.: WO2007096313.

Research output: PatentProfessional

TY - PAT

T1 - PLANAR HEAT PIPE FOR COOLING

AU - Wits, Wessel Willems

AU - Mannak, Jan, Hendrik

AU - Legtenberg,, Rob

PY - 2007/8/30

Y1 - 2007/8/30

N2 - There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5), at least one of the panels (1, 2) being grooved (9) on its metal clad side, the panels (1, 2) being assembled by their metal clad sides to form a sealed cavity (8), the cavity (8) being filled with a fluid (10), the fluid (10) circulating by capillary action along the grooves (9) towards zones exposed to heat where it vaporizes.

AB - There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5), at least one of the panels (1, 2) being grooved (9) on its metal clad side, the panels (1, 2) being assembled by their metal clad sides to form a sealed cavity (8), the cavity (8) being filled with a fluid (10), the fluid (10) circulating by capillary action along the grooves (9) towards zones exposed to heat where it vaporizes.

M3 - Patent

M1 - WO2007096313

ER -

Wits WW, Mannak, Jan H, Legtenberg, R, inventors. PLANAR HEAT PIPE FOR COOLING. F28D 15/ 04 A I. 2007 Aug 30.