Planarization and fabrication of bridges across deep grooves or holes in silicon using a dry film photoresist followed by an etch back

V.L. Spiering, J.W. Berenschot, M. Elwenspoek

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    Abstract

    A technique is presented that provides planarization after a very deep etching step in silicon. This offers the possibility for not only resist spinning and layer patterning but also for realization of bridges and cantilevers across deep grooves or holes. The technique contains a standard dry film lamination step to cover a wafer with a 38 μm thick foil. Next the foil is etched back to the desired thickness of a few micrometers. This thin film facilitates resist spinning and high-resolution patterning. The planarization method is demonstrated by the fabrication of aluminum bridges across a deep groove in silicon.
    Original languageEnglish
    Pages (from-to)189-192
    Number of pages4
    JournalJournal of micromechanics and microengineering
    Volume5
    Issue number2
    DOIs
    Publication statusPublished - Jun 1995
    Event5th MicroMechanics Europe Workshop, MME 1994 - Pisa, Italy
    Duration: 5 Sep 19946 Sep 1994
    Conference number: 5

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