A technique is presented that provides planarization after a very deep etching step in silicon. This offers the possibility for not only resist spinning and layer patterning but also for realization of bridges and cantilevers across deep grooves or holes. The technique contains a standard dry film lamination step to cover a wafer with a 38 μm thick foil. Next the foil is etched back to the desired thickness of a few micrometers. This thin film facilitates resist spinning and high-resolution patterning. The planarization method is demonstrated by the fabrication of aluminum bridges across a deep groove in silicon.
|Number of pages||4|
|Journal||Journal of micromechanics and microengineering|
|Publication status||Published - Jun 1995|
|Event||5th MicroMechanics Europe Workshop, MME 1994 - Pisa, Italy|
Duration: 5 Sep 1994 → 6 Sep 1994
Conference number: 5