Planarization and fabrication of bridges across groves or holes in silicon using a dry film photoresist followed by an etch back

V.L. Spiering, Johan W. Berenschot, Michael Curt Elwenspoek

    Research output: Contribution to journalArticleAcademicpeer-review

    Original languageUndefined
    Pages (from-to)189-192
    JournalJournal of micromechanics and microengineering
    Issue number5
    Publication statusPublished - 1995

    Keywords

    • METIS-129073

    Cite this

    @article{3cf23e175acd4c62927968686483bdf6,
    title = "Planarization and fabrication of bridges across groves or holes in silicon using a dry film photoresist followed by an etch back",
    keywords = "METIS-129073",
    author = "V.L. Spiering and Berenschot, {Johan W.} and Elwenspoek, {Michael Curt}",
    year = "1995",
    language = "Undefined",
    pages = "189--192",
    journal = "Journal of micromechanics and microengineering",
    issn = "0960-1317",
    publisher = "IOP Publishing Ltd.",
    number = "5",

    }

    Planarization and fabrication of bridges across groves or holes in silicon using a dry film photoresist followed by an etch back. / Spiering, V.L.; Berenschot, Johan W.; Elwenspoek, Michael Curt.

    In: Journal of micromechanics and microengineering, No. 5, 1995, p. 189-192.

    Research output: Contribution to journalArticleAcademicpeer-review

    TY - JOUR

    T1 - Planarization and fabrication of bridges across groves or holes in silicon using a dry film photoresist followed by an etch back

    AU - Spiering, V.L.

    AU - Berenschot, Johan W.

    AU - Elwenspoek, Michael Curt

    PY - 1995

    Y1 - 1995

    KW - METIS-129073

    M3 - Article

    SP - 189

    EP - 192

    JO - Journal of micromechanics and microengineering

    JF - Journal of micromechanics and microengineering

    SN - 0960-1317

    IS - 5

    ER -