Plasma Charging Damage Induced by a Power Ramp Down Step in the end of Plasma Enhanced Chemical Vapour Deposition (PECVD) Process

Zhichun Wang, J.G.G. Ackaert, Cora Salm, F.G. Kuper, K. Bessemans, E. De Backer

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of Semiconductor Advances for Future Electronics SAFE 2003
    Number of pages5
    Publication statusPublished - 25 Nov 2003


    • METIS-213263

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