Plasmonic interconnects for global wires in integrated circuits

Soo Jin Chua*, Yan Liu, Lu Ding, Aaron Thean, Ting Mei, Christian A. Nijhuis

*Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

Abstract

Surface plasmon polaritons (SPPs) are bound electromagnetic waves propagating at a dielectric-metal interface, which have gained attention for high performance and ability for miniaturisation in high-speed dense circuits, due to their subwavelength properties. A dielectric-metal-dielectric (I-M-I) plasmonic waveguide with a 40 nm thick metal or metal-like strip on silicon substrate is proposed for intra-chip communication. The propagation characteristics of the I-M-I waveguide are investigated by numerical simulation and the modes are experimentally verified by scanning near-field optical microscopy. Metal lines as thin as 40 nm can have propagation lengths as large as 239 µm, which has small footprint compatible with the advanced interconnect process.

Original languageEnglish
Pages (from-to)541-549
Number of pages9
JournalInternational Journal of Nanotechnology
Volume17
Issue number7-10
DOIs
Publication statusPublished - 2020
Externally publishedYes

Keywords

  • Insulator-metal-insulator plasmonic waveguide
  • Intra-chip communication
  • Long-range surface plasmon polaritons
  • LR-SPP
  • Near-field signal
  • Plasmonic interconnect
  • NLA

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