Polymer bonding of micro-machined silicon structures

C. den Besten, R.E.G. van Hal, J. Munoz, P. Bergveld

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    Polymer bonding is an indirect bonding technique that can be performed at temperatures of less than 150°C. Thin layers of negative photoresist polyimide and epoxy were used to bond micromachined test devices to other pieces of silicon. The strength of the resulting bond and the influence of primers like APS and HMDS on the bond strength were tested. The best results were achieved with negative photoresist without primer at a curing temperature of 130°C. The bond strength was more than 130 kg/cm2
    Original languageEnglish
    Title of host publicationProceedings IEEE Micro Electro Mechanical Systems, MEMS '92
    Place of PublicationPiscataway, NJ
    Number of pages6
    ISBN (Print)9780780304970
    Publication statusPublished - 4 Feb 1992
    EventIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1992 - Travemünde, Germany
    Duration: 4 Feb 19927 Feb 1992


    WorkshopIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1992
    Abbreviated titleMEMS


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