Polymer bonding of micro-machined silicon structures

C. den Besten; R.E.G. van Hal; J. Munoz; P. Bergveld

doi:10.1109/MEMSYS.1992.187699

Polymer bonding of micro-machined silicon structures

C. den Besten, R.E.G. van Hal, J. Munoz, P. Bergveld

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

Polymer bonding is an indirect bonding technique that can be performed at temperatures of less than 150°C. Thin layers of negative photoresist polyimide and epoxy were used to bond micromachined test devices to other pieces of silicon. The strength of the resulting bond and the influence of primers like APS and HMDS on the bond strength were tested. The best results were achieved with negative photoresist without primer at a curing temperature of 130°C. The bond strength was more than 130 kg/cm2

Original language	English
Title of host publication	Proceedings IEEE Micro Electro Mechanical Systems, MEMS '92
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	104-109
Number of pages	6
ISBN (Print)	9780780304970
DOIs	https://doi.org/10.1109/MEMSYS.1992.187699
Publication status	Published - 4 Feb 1992
Event	IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1992 - Travemünde, Germany Duration: 4 Feb 1992 → 7 Feb 1992

Workshop

Workshop	IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1992
Abbreviated title	MEMS
Country/Territory	Germany
City	Travemünde
Period	4/02/92 → 7/02/92

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10.1109/MEMSYS.1992.187699

DenBesten1992polymerFinal published version, 341 KB

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title = "Polymer bonding of micro-machined silicon structures",

abstract = "Polymer bonding is an indirect bonding technique that can be performed at temperatures of less than 150°C. Thin layers of negative photoresist polyimide and epoxy were used to bond micromachined test devices to other pieces of silicon. The strength of the resulting bond and the influence of primers like APS and HMDS on the bond strength were tested. The best results were achieved with negative photoresist without primer at a curing temperature of 130°C. The bond strength was more than 130 kg/cm2",

author = "{den Besten}, C. and {van Hal}, R.E.G. and J. Munoz and P. Bergveld",

year = "1992",

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doi = "10.1109/MEMSYS.1992.187699",

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isbn = "9780780304970",

pages = "104--109",

booktitle = "Proceedings IEEE Micro Electro Mechanical Systems, MEMS '92",

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note = "IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1992, MEMS ; Conference date: 04-02-1992 Through 07-02-1992",

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T1 - Polymer bonding of micro-machined silicon structures

AU - den Besten, C.

AU - van Hal, R.E.G.

AU - Munoz, J.

AU - Bergveld, P.

PY - 1992/2/4

Y1 - 1992/2/4

N2 - Polymer bonding is an indirect bonding technique that can be performed at temperatures of less than 150°C. Thin layers of negative photoresist polyimide and epoxy were used to bond micromachined test devices to other pieces of silicon. The strength of the resulting bond and the influence of primers like APS and HMDS on the bond strength were tested. The best results were achieved with negative photoresist without primer at a curing temperature of 130°C. The bond strength was more than 130 kg/cm2

AB - Polymer bonding is an indirect bonding technique that can be performed at temperatures of less than 150°C. Thin layers of negative photoresist polyimide and epoxy were used to bond micromachined test devices to other pieces of silicon. The strength of the resulting bond and the influence of primers like APS and HMDS on the bond strength were tested. The best results were achieved with negative photoresist without primer at a curing temperature of 130°C. The bond strength was more than 130 kg/cm2

U2 - 10.1109/MEMSYS.1992.187699

DO - 10.1109/MEMSYS.1992.187699

M3 - Conference contribution

SN - 9780780304970

SP - 104

EP - 109

BT - Proceedings IEEE Micro Electro Mechanical Systems, MEMS '92

PB - IEEE

CY - Piscataway, NJ

T2 - IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1992

Y2 - 4 February 1992 through 7 February 1992

ER -

Polymer bonding of micro-machined silicon structures

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