Polymer Microneedles

Yehoshua Yeshurun; Meir Hefetz; Johan W. Berenschot; Meint J. de Boer; Dominique Altpeter; Garrit Boom; G. Boom

Polymer Microneedles

Yehoshua Yeshurun (Inventor), Meir Hefetz (Inventor), Johan W. Berenschot (Inventor), Meint J. de Boer (Inventor), Dominique Altpeter (Inventor), Garrit Boom (Inventor), G. Boom (Inventor)

Research output: Patent

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Abstract

A method for producing microneedles. The method including disposing a first layer of a radiation sensitive polymer on to a working surface and selectively irradiating the first layer such that the first layer has at least one irradiated region and at least one non-irradiated region. The method also including developing the first layer so as to selectively remove one of the at least one irradiated region and the at least one non-irradiated region such that, at least part of at least one remaining region at least partially defines a form of at least part of a microneedle structure. A microneedle structure including a plurality of microneedles at least partially formed from a radiation sensitive polymer.

Original language	Undefined
Patent number	US20030397359
Priority date	2/08/05
Publication status	Submitted - 27 Mar 2003

Keywords

IR-76060
EWI-20133
METIS-229588
EWI-19677

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Cite this

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title = "Polymer Microneedles",

abstract = "A method for producing microneedles. The method including disposing a first layer of a radiation sensitive polymer on to a working surface and selectively irradiating the first layer such that the first layer has at least one irradiated region and at least one non-irradiated region. The method also including developing the first layer so as to selectively remove one of the at least one irradiated region and the at least one non-irradiated region such that, at least part of at least one remaining region at least partially defines a form of at least part of a microneedle structure. A microneedle structure including a plurality of microneedles at least partially formed from a radiation sensitive polymer.",

keywords = "IR-76060, EWI-20133, METIS-229588, EWI-19677",

author = "Yehoshua Yeshurun and Meir Hefetz and Berenschot, {Johan W.} and {de Boer}, {Meint J.} and Dominique Altpeter and Garrit Boom and G. Boom",

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year = "2003",

month = mar,

day = "27",

language = "Undefined",

type = "Patent",

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TY - PAT

T1 - Polymer Microneedles

AU - Yeshurun, Yehoshua

AU - Hefetz, Meir

AU - Berenschot, Johan W.

AU - de Boer, Meint J.

AU - Altpeter, Dominique

AU - Boom, Garrit

AU - Boom, G.

N1 - http://www.freepatentsonline.com/6924087.pdf

PY - 2003/3/27

Y1 - 2003/3/27

N2 - A method for producing microneedles. The method including disposing a first layer of a radiation sensitive polymer on to a working surface and selectively irradiating the first layer such that the first layer has at least one irradiated region and at least one non-irradiated region. The method also including developing the first layer so as to selectively remove one of the at least one irradiated region and the at least one non-irradiated region such that, at least part of at least one remaining region at least partially defines a form of at least part of a microneedle structure. A microneedle structure including a plurality of microneedles at least partially formed from a radiation sensitive polymer.

AB - A method for producing microneedles. The method including disposing a first layer of a radiation sensitive polymer on to a working surface and selectively irradiating the first layer such that the first layer has at least one irradiated region and at least one non-irradiated region. The method also including developing the first layer so as to selectively remove one of the at least one irradiated region and the at least one non-irradiated region such that, at least part of at least one remaining region at least partially defines a form of at least part of a microneedle structure. A microneedle structure including a plurality of microneedles at least partially formed from a radiation sensitive polymer.

KW - IR-76060

KW - EWI-20133

KW - METIS-229588

KW - EWI-19677

M3 - Patent

M1 - US20030397359

ER -