Prediction of void growth using gradient enhanced polycrystal plasticity

Emin Semih Perdahcioglu*, Emin Erkan Asik, A. H. Van Den Boogaard

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)


The growth of existing voids in the microstructure is governed by the localized plastic deformation around their boundaries. These voids are initially around an order of magnitude smaller than the grain size of common metallic materials. Consequently, the plastic deformation around the void can be reasonably well approximated by the crystal plasticity finite modeling approach. On the other hand, due to the intrinsic size scales involved, the gradient of the plastic strain will be very large which is known to result in generation of significant amounts of Geometrically Necessary Dislocations. These have a direct influence on the governing equations of plasticity and hence the growth process. Therefore, the proposed approach takes into account hardening based on dislocation densities which include the GNDs as a source of dislocations. The generation of GNDs is modeled using a gradient enhancement in the finite element simulation. The growth of voids are qualitatively compared to experimental results found in the literature.

Original languageEnglish
Title of host publicationProceedings of the 22nd International ESAFORM Conference on Material Forming, ESAFORM 2019
EditorsPedro Arrazola, Eneko Saenz de Argandona, Nagore Otegi, Joseba Mendiguren, Mikel Saez de Buruaga, Aitor Madariaga, Lander Galdos
PublisherAmerican Institute of Physics
ISBN (Electronic)9780735418479
Publication statusPublished - 2 Jul 2019
Event22nd International Conference on Material Forming 2019 - Votoria-Gasteiz, Spain
Duration: 8 May 201910 May 2019
Conference number: 22

Publication series

NameAIP Conference Proceedings
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616


Conference22nd International Conference on Material Forming 2019
Abbreviated titleESAFORM 2019
Internet address


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