Abstract
The invention discloses a preparation method and application of a columnar embedded type flexible circuit. The method includes the steps of coating a supporting material with a viscous-state macro-molecule material, spraying conductive ink for printing, making the conductive ink deposit in the viscous-state macro-molecule material under the spraying impact effect of a spray nozzle, and finally conducting solidification through heating or illuminating to obtain the columnar embedded flexible circuit, wherein the conductive circuit is formed after the conductive ink is dried, the viscous-state macro-molecule material is solidified into a film, and the packing material of the conductive circuit is formed. The width and height of a single wire of the prepared conductive circuit each range from 500 nanometers to 50 microns, the ratio of width to height ranges from 0.5 to 2, and the distance between the wire and an upper interface of a packing base material and the distance between the wire and a lower interface of the packing base material each range from 10 microns to 100 microns. By means of the method and application, the thickness and printing accuracy of the printing circuit are greatly improved while high pollution and high cost during exposure etching are avoided; by means of the method of packing the circuit at a time, the subsequent packing process is omitted, and the preparation method can be applied to the field of preparing transparent ultra-thin flexible circuit boards, high-integration-density flat cables and the like.
| Original language | English |
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| Patent number | CN104735917 |
| IPC | H05K 3/ 12 A I |
| Priority date | 30/03/15 |
| Publication status | Published - 24 Jun 2015 |