Preparation of a dual sputtering PD-Cu alloy film and its application in hydrogen separation

D.H. Tong, H.T.H. Hoang Thi Hanh, F.C. Gielens, Henricus V. Jansen, Michael Curt Elwenspoek

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    Abstract

    Sub-micron thick Pd-Cu alloy films have been deposited by a dual sputtering, which allows a high morphology and phase structure of the sputtered layers were investigated by energy dispersive spectrometer (EDS), E-ray photoelectron spectroscopy (XPS), scanning electron microscope (ESM), transmission electron microscope (TEM) and X-ray diffraction (XRD), respectively. The resulgs proved that the Pd-Cu layers were the ally of pure Pd and pure Cu. The characterized Pd-Cu ally layers were deposited on a hydrogen separation. High fluxes of up to 1.6 mol H2/m2.s have been measured through a750 nm Pd-Cu at 723 K with the minimal selectivity of about 500 for H2 over He.
    Original languageUndefined
    Title of host publication14th MicroMechanics Europe Workshop, MME 2003
    Place of PublicationDelft
    PublisherMicroMechanics Europe
    Pages1-4
    Number of pages4
    ISBN (Print)9080826618
    Publication statusPublished - 2 Nov 2003
    Event14th MicroMechanics Europe Workshop, MME 2003 - Delft, Netherlands
    Duration: 2 Nov 20034 Nov 2003
    Conference number: 14

    Publication series

    Name
    PublisherEburon

    Conference

    Conference14th MicroMechanics Europe Workshop, MME 2003
    Abbreviated titleMME
    CountryNetherlands
    CityDelft
    Period2/11/034/11/03

    Keywords

    • METIS-214515
    • EWI-19725
    • IR-46301

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