Preparation of a dual sputtering PD-Cu alloy film and its application in hydrogen separation

D.H. Tong, H.T.H. Hoang Thi Hanh, F.C. Gielens, Henricus V. Jansen, Michael Curt Elwenspoek

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    Sub-micron thick Pd-Cu alloy films have been deposited by a dual sputtering, which allows a high morphology and phase structure of the sputtered layers were investigated by energy dispersive spectrometer (EDS), E-ray photoelectron spectroscopy (XPS), scanning electron microscope (ESM), transmission electron microscope (TEM) and X-ray diffraction (XRD), respectively. The resulgs proved that the Pd-Cu layers were the ally of pure Pd and pure Cu. The characterized Pd-Cu ally layers were deposited on a hydrogen separation. High fluxes of up to 1.6 mol H2/m2.s have been measured through a750 nm Pd-Cu at 723 K with the minimal selectivity of about 500 for H2 over He.
    Original languageUndefined
    Title of host publication14th MicroMechanics Europe Workshop, MME 2003
    Place of PublicationDelft
    PublisherMicroMechanics Europe
    Number of pages4
    ISBN (Print)9080826618
    Publication statusPublished - 2 Nov 2003
    Event14th MicroMechanics Europe Workshop, MME 2003 - Delft, Netherlands
    Duration: 2 Nov 20034 Nov 2003
    Conference number: 14

    Publication series



    Conference14th MicroMechanics Europe Workshop, MME 2003
    Abbreviated titleMME


    • METIS-214515
    • EWI-19725
    • IR-46301

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