Present and future role of chemical mechanical polishing in wafer bonding

C. Gui; Michael Curt Elwenspoek; Johannes G.E. Gardeniers; Paul Lambeck

doi:10.1149/1.1838616

Present and future role of chemical mechanical polishing in wafer bonding

C. Gui, Michael Curt Elwenspoek, Johannes G.E. Gardeniers, Paul Lambeck

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Abstract

Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated optics, sensors and actuators, and microelectromechanical systems.

Original language	Undefined
Pages (from-to)	2198-2204
Number of pages	7
Journal	Journal of the Electrochemical Society
Volume	145
Issue number	6
DOIs	https://doi.org/10.1149/1.1838616
Publication status	Published - Jun 1998

Keywords

EWI-13451
IR-55977

Access to Document

10.1149/1.1838616

JECS_145_2198

Cite this

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title = "Present and future role of chemical mechanical polishing in wafer bonding",

abstract = "Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated optics, sensors and actuators, and microelectromechanical systems.",

keywords = "EWI-13451, IR-55977",

author = "C. Gui and Elwenspoek, {Michael Curt} and Gardeniers, {Johannes G.E.} and Paul Lambeck",

year = "1998",

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AU - Gui, C.

AU - Elwenspoek, Michael Curt

AU - Gardeniers, Johannes G.E.

AU - Lambeck, Paul

PY - 1998/6

Y1 - 1998/6

N2 - Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated optics, sensors and actuators, and microelectromechanical systems.

AB - Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated optics, sensors and actuators, and microelectromechanical systems.

KW - EWI-13451

KW - IR-55977

U2 - 10.1149/1.1838616

DO - 10.1149/1.1838616

M3 - Article

SN - 0013-4651

VL - 145

SP - 2198

EP - 2204

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

IS - 6

ER -