Abstract
Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated optics, sensors and actuators, and microelectromechanical systems.
Original language | Undefined |
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Pages (from-to) | 2198-2204 |
Number of pages | 7 |
Journal | Journal of the Electrochemical Society |
Volume | 145 |
Issue number | 6 |
DOIs | |
Publication status | Published - Jun 1998 |
Keywords
- EWI-13451
- IR-55977