Present and future role of chemical mechanical polishing in wafer bonding

C. Gui, Michael Curt Elwenspoek, Johannes G.E. Gardeniers, Paul Lambeck

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Abstract

Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated optics, sensors and actuators, and microelectromechanical systems.
Original languageUndefined
Pages (from-to)2198-2204
Number of pages7
JournalJournal of the Electrochemical Society
Volume145
Issue number6
DOIs
Publication statusPublished - Jun 1998

Keywords

  • EWI-13451
  • IR-55977

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