Present and future role of CMP in wafer bonding

C. Gui, Michael Curt Elwenspoek, Johannes G.E. Gardeniers, Paul Lambeck

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageUndefined
Title of host publicationProceedings of the fourth International Symposium on Semiconductor wafer bonding: science, technology and applications
Place of PublicationParis, France
Pages114-126
Publication statusPublished - 31 Aug 1998

Keywords

  • METIS-112754
  • IR-15872

Cite this

Gui, C., Elwenspoek, M. C., Gardeniers, J. G. E., & Lambeck, P. (1998). Present and future role of CMP in wafer bonding. In Proceedings of the fourth International Symposium on Semiconductor wafer bonding: science, technology and applications (pp. 114-126). Paris, France.