Present and future role of CMP in wafer bonding

C. Gui; Michael Curt Elwenspoek; Johannes G.E. Gardeniers; Paul Lambeck

Present and future role of CMP in wafer bonding

C. Gui, Michael Curt Elwenspoek, Johannes G.E. Gardeniers, Paul Lambeck

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	Undefined
Title of host publication	Proceedings of the fourth International Symposium on Semiconductor wafer bonding: science, technology and applications
Place of Publication	Paris, France
Pages	114-126
Publication status	Published - 31 Aug 1998
Event	Fourth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications - Paris, France Duration: 1 Jan 1998 → 1 Jan 1998

Conference

Conference	Fourth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications
Period	1/01/98 → 1/01/98

Keywords

METIS-112754
IR-15872

Cite this

@inproceedings{789c9625b6e94dad9a730bd72ad0c609,

title = "Present and future role of CMP in wafer bonding",

keywords = "METIS-112754, IR-15872",

author = "C. Gui and Elwenspoek, {Michael Curt} and Gardeniers, {Johannes G.E.} and Paul Lambeck",

year = "1998",

month = aug,

day = "31",

language = "Undefined",

isbn = "1-56677-189-7",

pages = "114--126",

booktitle = "Proceedings of the fourth International Symposium on Semiconductor wafer bonding: science, technology and applications",

note = "Fourth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications ; Conference date: 01-01-1998 Through 01-01-1998",

}

Present and future role of CMP in wafer bonding. / Gui, C.; Elwenspoek, Michael Curt; Gardeniers, Johannes G.E. et al.
Proceedings of the fourth International Symposium on Semiconductor wafer bonding: science, technology and applications. Paris, France, 1998. p. 114-126.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Present and future role of CMP in wafer bonding

AU - Gui, C.

AU - Elwenspoek, Michael Curt

AU - Gardeniers, Johannes G.E.

AU - Lambeck, Paul

PY - 1998/8/31

Y1 - 1998/8/31

KW - METIS-112754

KW - IR-15872

M3 - Conference contribution

SN - 1-56677-189-7

SP - 114

EP - 126

BT - Proceedings of the fourth International Symposium on Semiconductor wafer bonding: science, technology and applications

CY - Paris, France

T2 - Fourth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications

Y2 - 1 January 1998 through 1 January 1998

ER -