Probing microbubble adhesion using secondary acoustic radiation force

T.J.A. Kokhuis, V. Garbin, K. Kooiman, B.A. Naaijkens, L.J.M. Juffermans, O. Kamp, M. Versluis, A.F.W. van der Steen, N. de Jong

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publication2011 IEEE International Ultrasonics Symposium (IUS)
Subtitle of host publication18-21 Oct. 2011
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages947-950
Number of pages4
ISBN (Electronic)978-1-4577-1252-4
ISBN (Print)978-1-4577-1253-1
DOIs
Publication statusPublished - 18 Oct 2012
EventIEEE International Ultrasonics Symposium, IUS 2011 - Orlando, United States
Duration: 18 Oct 201121 Oct 2011

Conference

ConferenceIEEE International Ultrasonics Symposium, IUS 2011
Abbreviated titleIUS
CountryUnited States
CityOrlando
Period18/10/1121/10/11

Keywords

  • Targeted microbubbles
  • Acoustic radiation force
  • Binding force
  • Translational dynamics
  • Detachment

Cite this

Kokhuis, T. J. A., Garbin, V., Kooiman, K., Naaijkens, B. A., Juffermans, L. J. M., Kamp, O., ... de Jong, N. (2012). Probing microbubble adhesion using secondary acoustic radiation force. In 2011 IEEE International Ultrasonics Symposium (IUS): 18-21 Oct. 2011 (pp. 947-950). Piscataway, NJ: IEEE. https://doi.org/10.1109/ULTSYM.2011.0232
Kokhuis, T.J.A. ; Garbin, V. ; Kooiman, K. ; Naaijkens, B.A. ; Juffermans, L.J.M. ; Kamp, O. ; Versluis, M. ; van der Steen, A.F.W. ; de Jong, N. / Probing microbubble adhesion using secondary acoustic radiation force. 2011 IEEE International Ultrasonics Symposium (IUS): 18-21 Oct. 2011. Piscataway, NJ : IEEE, 2012. pp. 947-950
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title = "Probing microbubble adhesion using secondary acoustic radiation force",
keywords = "Targeted microbubbles, Acoustic radiation force, Binding force, Translational dynamics, Detachment",
author = "T.J.A. Kokhuis and V. Garbin and K. Kooiman and B.A. Naaijkens and L.J.M. Juffermans and O. Kamp and M. Versluis and {van der Steen}, A.F.W. and {de Jong}, N.",
year = "2012",
month = "10",
day = "18",
doi = "10.1109/ULTSYM.2011.0232",
language = "English",
isbn = "978-1-4577-1253-1",
pages = "947--950",
booktitle = "2011 IEEE International Ultrasonics Symposium (IUS)",
publisher = "IEEE",
address = "United States",

}

Kokhuis, TJA, Garbin, V, Kooiman, K, Naaijkens, BA, Juffermans, LJM, Kamp, O, Versluis, M, van der Steen, AFW & de Jong, N 2012, Probing microbubble adhesion using secondary acoustic radiation force. in 2011 IEEE International Ultrasonics Symposium (IUS): 18-21 Oct. 2011. IEEE, Piscataway, NJ, pp. 947-950, IEEE International Ultrasonics Symposium, IUS 2011, Orlando, United States, 18/10/11. https://doi.org/10.1109/ULTSYM.2011.0232

Probing microbubble adhesion using secondary acoustic radiation force. / Kokhuis, T.J.A.; Garbin, V.; Kooiman, K.; Naaijkens, B.A.; Juffermans, L.J.M.; Kamp, O.; Versluis, M.; van der Steen, A.F.W.; de Jong, N.

2011 IEEE International Ultrasonics Symposium (IUS): 18-21 Oct. 2011. Piscataway, NJ : IEEE, 2012. p. 947-950.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Probing microbubble adhesion using secondary acoustic radiation force

AU - Kokhuis, T.J.A.

AU - Garbin, V.

AU - Kooiman, K.

AU - Naaijkens, B.A.

AU - Juffermans, L.J.M.

AU - Kamp, O.

AU - Versluis, M.

AU - van der Steen, A.F.W.

AU - de Jong, N.

PY - 2012/10/18

Y1 - 2012/10/18

KW - Targeted microbubbles

KW - Acoustic radiation force

KW - Binding force

KW - Translational dynamics

KW - Detachment

U2 - 10.1109/ULTSYM.2011.0232

DO - 10.1109/ULTSYM.2011.0232

M3 - Conference contribution

SN - 978-1-4577-1253-1

SP - 947

EP - 950

BT - 2011 IEEE International Ultrasonics Symposium (IUS)

PB - IEEE

CY - Piscataway, NJ

ER -

Kokhuis TJA, Garbin V, Kooiman K, Naaijkens BA, Juffermans LJM, Kamp O et al. Probing microbubble adhesion using secondary acoustic radiation force. In 2011 IEEE International Ultrasonics Symposium (IUS): 18-21 Oct. 2011. Piscataway, NJ: IEEE. 2012. p. 947-950 https://doi.org/10.1109/ULTSYM.2011.0232