Process for producing micromechanical structures by means of reactieve ion etching

Meint J. de Boer (Inventor), Henricus V. Jansen (Inventor), G.J. Burger (Inventor), J. Elders (Inventor), Rob Legtenberg (Inventor), Michael Curt Elwenspoek (Inventor), R. Legtenberg (Inventor), J.H.J. Fluitman (Inventor)

    Research output: Patent

    34 Downloads (Pure)


    A process for producing etched micromechanical structures is provided, using Reactive Ion Etching (RIE), wherein a substrate is etched with a silicon etch gas mixture to obtain an aspect ratio of at least 10. The process comprises the steps of: a) anisotropic etching using a first silicon etch gas to obtain a primary microstructure; b) depositing a halocarbon film on the walls of the primary microstructure; d) isotropic etching using a second silicon etch gas, to obtain a final microstructure; said steps being carried out in a single run. Optional further steps are: c) etching the floor of the primary microstructure using said first silicon etch gas; and e) depositing a halocarbon film on the surface of the final microstructure. The process may involve applying high pressure (5-30 Pa) and low energy (10-90 eV), and preferably the use of a sulphur hexafluoride/oxygen/trifluoromethane plasma. The process can be controlled by monitoring the blackening of a silicon test surface as a function of varying the process parameters.
    Original languageUndefined
    Patent numberWO1995NL00221
    Priority date22/06/95
    Publication statusSubmitted - 22 Jun 1995


    • METIS-118325
    • EWI-18834
    • IR-74705

    Cite this