Process Maturity Grids used a Decision Support Tool

R.G.J. Arendsen; A.C. Brombacher; B. Habraken; O.E. Herrmann

Process Maturity Grids used a Decision Support Tool

R.G.J. Arendsen, A.C. Brombacher, B. Habraken, O.E. Herrmann

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

Failure rates of modern ASICs and ASSPs can not be demonstrated using reliability tests on product level. Reliability demonstration must be done by
quantifying the quality of the process that produces these integrated circuits. Process capability however, is not fixed over time. As a process gets more mature process capability tends to improve. In this paper we introduce the concept of process maturity growth to quantify the quality of suppliers processes as a function of time. The method is illustrated for a submicron double metal CMOS process in which many mixed standard cell and full custom designs are processed.

Original language	English
Title of host publication	5th European Symposium of Electron Devices, Failure Physics and Analysis
Subtitle of host publication	Glasgow, Scotland, 4-7 October 1994
Place of Publication	Glasgow, Scotland
Publisher	QaRel Associates
Pages	321-326
Publication status	Published - 1 Jun 1995
Event	5th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 1994 - Glasgow, Scotland, United Kingdom Duration: 4 Oct 1994 → 7 Oct 1994 Conference number: 5

Conference

Conference	5th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 1994
Abbreviated title	ESREF 1994
Country/Territory	United Kingdom
City	Glasgow, Scotland
Period	4/10/94 → 7/10/94

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title = "Process Maturity Grids used a Decision Support Tool",

abstract = "Failure rates of modern ASICs and ASSPs can not be demonstrated using reliability tests on product level. Reliability demonstration must be done by quantifying the quality of the process that produces these integrated circuits. Process capability however, is not fixed over time. As a process gets more mature process capability tends to improve. In this paper we introduce the concept of process maturity growth to quantify the quality of suppliers processes as a function of time. The method is illustrated for a submicron double metal CMOS process in which many mixed standard cell and full custom designs are processed.",

author = "R.G.J. Arendsen and A.C. Brombacher and B. Habraken and O.E. Herrmann",

year = "1995",

month = jun,

day = "1",

language = "English",

pages = "321--326",

booktitle = "5th European Symposium of Electron Devices, Failure Physics and Analysis",

publisher = "QaRel Associates",

note = "5th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 1994, ESREF 1994 ; Conference date: 04-10-1994 Through 07-10-1994",

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Arendsen, RGJ, Brombacher, AC, Habraken, B & Herrmann, OE 1995, Process Maturity Grids used a Decision Support Tool. in 5th European Symposium of Electron Devices, Failure Physics and Analysis: Glasgow, Scotland, 4-7 October 1994. QaRel Associates, Glasgow, Scotland, pp. 321-326, 5th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 1994, Glasgow, Scotland, United Kingdom, 4/10/94.

Process Maturity Grids used a Decision Support Tool. / Arendsen, R.G.J.; Brombacher, A.C.; Habraken, B. et al.
5th European Symposium of Electron Devices, Failure Physics and Analysis: Glasgow, Scotland, 4-7 October 1994. Glasgow, Scotland: QaRel Associates, 1995. p. 321-326.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Process Maturity Grids used a Decision Support Tool

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AU - Brombacher, A.C.

AU - Habraken, B.

AU - Herrmann, O.E.

N1 - Conference code: 5

PY - 1995/6/1

Y1 - 1995/6/1

N2 - Failure rates of modern ASICs and ASSPs can not be demonstrated using reliability tests on product level. Reliability demonstration must be done by quantifying the quality of the process that produces these integrated circuits. Process capability however, is not fixed over time. As a process gets more mature process capability tends to improve. In this paper we introduce the concept of process maturity growth to quantify the quality of suppliers processes as a function of time. The method is illustrated for a submicron double metal CMOS process in which many mixed standard cell and full custom designs are processed.

AB - Failure rates of modern ASICs and ASSPs can not be demonstrated using reliability tests on product level. Reliability demonstration must be done by quantifying the quality of the process that produces these integrated circuits. Process capability however, is not fixed over time. As a process gets more mature process capability tends to improve. In this paper we introduce the concept of process maturity growth to quantify the quality of suppliers processes as a function of time. The method is illustrated for a submicron double metal CMOS process in which many mixed standard cell and full custom designs are processed.

M3 - Conference contribution

SP - 321

EP - 326

BT - 5th European Symposium of Electron Devices, Failure Physics and Analysis

PB - QaRel Associates

CY - Glasgow, Scotland

T2 - 5th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 1994

Y2 - 4 October 1994 through 7 October 1994

ER -

Process Maturity Grids used a Decision Support Tool

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