TY - JOUR
T1 - Proportional control valves integrated in silicon nitride surface channel technology
AU - Groen, Maarten
AU - Groenesteijn, Jarno
AU - Meutstege, Esken
AU - Brookhuis, Robert Anton
AU - Brouwer, Dannis Michel
AU - Lötters, Joost Conrad
AU - Wiegerink, Remco J.
PY - 2015/6/25
Y1 - 2015/6/25
N2 - We have designed and realized two types of proportional microcontrol valves in a silicon nitride surface channel technology process. This enables on-die integration of flow controllers with other surface channel devices, such as pressure sensors or thermal or Coriolis-based (mass) flow sensors, to obtain a proportional gas flow control system on a single chip. One valve design is implemented with inlet and outlet channels in the plane of the chip, which allows on-chip flow control between several fluidic components and allows up to 70 mg h−1 of flow at 200 m bar. The other valve design operates out-of-plane between surface channels and a fluidic inlet, offering a flow range up to 1250 mg h−1 at 600 m bar, smaller footprint, and low-leakage closure. Measured flow behavior agrees well with laminar flow models created for both valve types.
AB - We have designed and realized two types of proportional microcontrol valves in a silicon nitride surface channel technology process. This enables on-die integration of flow controllers with other surface channel devices, such as pressure sensors or thermal or Coriolis-based (mass) flow sensors, to obtain a proportional gas flow control system on a single chip. One valve design is implemented with inlet and outlet channels in the plane of the chip, which allows on-chip flow control between several fluidic components and allows up to 70 mg h−1 of flow at 200 m bar. The other valve design operates out-of-plane between surface channels and a fluidic inlet, offering a flow range up to 1250 mg h−1 at 600 m bar, smaller footprint, and low-leakage closure. Measured flow behavior agrees well with laminar flow models created for both valve types.
KW - EC Grant Agreement nr.: FP7/2007-2013
KW - 22/3 OA procedure
U2 - 10.1109/JMEMS.2015.2436402
DO - 10.1109/JMEMS.2015.2436402
M3 - Article
SN - 1057-7157
VL - 24
SP - 1759
EP - 1767
JO - Journal of microelectromechanical systems
JF - Journal of microelectromechanical systems
IS - 6
ER -