PVD aluminium nitride as heat spreader in silicon-on-glass technology

L. La Spina*, H. Schellevis, N. Nenadović, L. K. Nanver

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)

Abstract

Physical-vapor-deposited aluminium nitride has been integrated in a silicon-on-glass NPN BJT process. Deposition conditions have been developed for which suitable electrical, mechanical and thermal properties are achieved. Electrothermal device characterization is used to demonstrate the effective heat spreading of this thin-film material.

Original languageEnglish
Title of host publication2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings
Pages365-368
Number of pages4
DOIs
Publication statusPublished - 1 Dec 2006
Externally publishedYes
Event2006 25th International Conference on Microelectronics, MIEL 2006 - Belgrade, Serbia
Duration: 14 May 200617 May 2006
Conference number: 25

Conference

Conference2006 25th International Conference on Microelectronics, MIEL 2006
Abbreviated titleMIEL 2006
CountrySerbia
CityBelgrade
Period14/05/0617/05/06

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