PVD aluminium nitride as heat spreader in silicon-on-glass technology

L. La Spina; H. Schellevis; N. Nenadović; L. K. Nanver

doi:10.1109/ICMEL.2006.1650968

PVD aluminium nitride as heat spreader in silicon-on-glass technology

L. La Spina^*, H. Schellevis, N. Nenadović, L. K. Nanver

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

5 Citations (Scopus)

Abstract

Physical-vapor-deposited aluminium nitride has been integrated in a silicon-on-glass NPN BJT process. Deposition conditions have been developed for which suitable electrical, mechanical and thermal properties are achieved. Electrothermal device characterization is used to demonstrate the effective heat spreading of this thin-film material.

Original language	English
Title of host publication	2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings
Pages	365-368
Number of pages	4
DOIs	https://doi.org/10.1109/ICMEL.2006.1650968
Publication status	Published - 1 Dec 2006
Externally published	Yes
Event	2006 25th International Conference on Microelectronics, MIEL 2006 - Belgrade, Serbia Duration: 14 May 2006 → 17 May 2006 Conference number: 25

Conference

Conference	2006 25th International Conference on Microelectronics, MIEL 2006
Abbreviated title	MIEL 2006
Country/Territory	Serbia
City	Belgrade
Period	14/05/06 → 17/05/06

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10.1109/ICMEL.2006.1650968

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title = "PVD aluminium nitride as heat spreader in silicon-on-glass technology",

abstract = "Physical-vapor-deposited aluminium nitride has been integrated in a silicon-on-glass NPN BJT process. Deposition conditions have been developed for which suitable electrical, mechanical and thermal properties are achieved. Electrothermal device characterization is used to demonstrate the effective heat spreading of this thin-film material.",

author = "{La Spina}, L. and H. Schellevis and N. Nenadovi{\'c} and Nanver, {L. K.}",

year = "2006",

month = dec,

day = "1",

doi = "10.1109/ICMEL.2006.1650968",

language = "English",

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note = "2006 25th International Conference on Microelectronics, MIEL 2006, MIEL 2006 ; Conference date: 14-05-2006 Through 17-05-2006",

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La Spina, L, Schellevis, H, Nenadović, N & Nanver, LK 2006, PVD aluminium nitride as heat spreader in silicon-on-glass technology. in 2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings., 1650968, pp. 365-368, 2006 25th International Conference on Microelectronics, MIEL 2006, Belgrade, Serbia, 14/05/06. https://doi.org/10.1109/ICMEL.2006.1650968

TY - GEN

T1 - PVD aluminium nitride as heat spreader in silicon-on-glass technology

AU - La Spina, L.

AU - Schellevis, H.

AU - Nenadović, N.

AU - Nanver, L. K.

N1 - Conference code: 25

PY - 2006/12/1

Y1 - 2006/12/1

N2 - Physical-vapor-deposited aluminium nitride has been integrated in a silicon-on-glass NPN BJT process. Deposition conditions have been developed for which suitable electrical, mechanical and thermal properties are achieved. Electrothermal device characterization is used to demonstrate the effective heat spreading of this thin-film material.

AB - Physical-vapor-deposited aluminium nitride has been integrated in a silicon-on-glass NPN BJT process. Deposition conditions have been developed for which suitable electrical, mechanical and thermal properties are achieved. Electrothermal device characterization is used to demonstrate the effective heat spreading of this thin-film material.

UR - http://www.scopus.com/inward/record.url?scp=77956529163&partnerID=8YFLogxK

U2 - 10.1109/ICMEL.2006.1650968

DO - 10.1109/ICMEL.2006.1650968

M3 - Conference contribution

AN - SCOPUS:77956529163

SN - 1424401178

SN - 9781424401178

SP - 365

EP - 368

BT - 2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings

T2 - 2006 25th International Conference on Microelectronics, MIEL 2006

Y2 - 14 May 2006 through 17 May 2006

ER -

PVD aluminium nitride as heat spreader in silicon-on-glass technology

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