Reducing EUV mask 3D effects by alternative metal absorbers

Vicky Philipsen, Kim Vu Luong, Laurent Souriau, Eric Hendrickx, Andreas Erdmann, Dongbo Xu, Peter Evanschitzky, Robbert W.E. Van De Kruijs, Arash Edrisi, Frank Scholze, Christian Laubis, Mathias Irmscher, Sandra Naasz, Christian Reuter

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

25 Citations (Scopus)


Over the recent years EUV lithography has demonstrated the patterning of ever shrinking feature sizes (enabling the N7 technology node and below), while the EUV mask has remained unaltered using a 70nm Ta-based absorber. This has led to experimentally observed Mask 3D (M3D) effects at wafer level, which are induced by the interaction between the oblique incident EUV light and the patterned absorber with typical thickness values in the order of several wavelengths. In this paper we exploit the optical properties of the absorber material of the EUV mask as M3D mitigation strategy. Using rigorous lithographic simulations, we screen potential single element absorber materials for their optical properties and their optimal thickness for minimum best focus variation through pitch at wafer level. In addition, the M3D mitigation by absorber material is evaluated by process window comparison of foundry N5 specific logic clips. In order to validate the rigorous simulation predictions and to test the processing feasibility of the alternative absorber materials, we have selected the candidate single elements Nickel and Cobalt for an experimental evaluation on wafer substrates. In this work, we present the film characterization as well as first patterning tests of these single element candidate absorber materials.

Original languageEnglish
Title of host publicationExtreme Ultraviolet (EUV) Lithography VIII
ISBN (Electronic)9781510607378
Publication statusPublished - 24 Mar 2017
EventSPIE Conference on Extreme Ultraviolet (EUV) Lithography VIII, 2017 - San Jose, United States
Duration: 27 Feb 20172 Mar 2017
Conference number: 8


ConferenceSPIE Conference on Extreme Ultraviolet (EUV) Lithography VIII, 2017
Country/TerritoryUnited States
CitySan Jose


  • absorber characterization
  • EUV mask absorber
  • mask 3D effects
  • rigorous mask 3D lithography simulation


Dive into the research topics of 'Reducing EUV mask 3D effects by alternative metal absorbers'. Together they form a unique fingerprint.

Cite this