Abstract
Traditionally the position of reliability analysis in the design and production process of electronic circuits is a position of reliability verification. A completed design is checked on reliability aspects and either rejected or accepted for production. This paper describes a method to model physical failure mechanisms within components in such a way that they can be used for reliability optimization, not after, but during the early phase of the design process. Furthermore a prototype of a CAD software tool is described, which can highlight components likely to fail and automatically adjust circuit parameters to improve product reliability.
| Original language | English |
|---|---|
| Pages (from-to) | 267-273 |
| Journal | Quality and reliability engineering international |
| Volume | 7 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 1991 |
Keywords
- CAD
- Reliability simulation
- Design centring
- Physical failure mechanisms
- Stressor-susceptibility analysis
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Brombacher, A. C., de Boer, H. A., Bennion, M., Fennema, P. H., & Hermann, O. E. (1991). Reliability improvement of electronic circuits based on physical failure mechanisms in components. Quality and reliability engineering international, 7(4), 267-273. https://doi.org/10.1002/qre.4680070412