Reliability improvement of electronic circuits based on physical failure mechanisms in components

A.C. Brombacher, H.A. de Boer, M. Bennion, P.H. Fennema, O.E. Hermann

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    Abstract

    Traditionally the position of reliability analysis in the design and production process of electronic circuits is a position of reliability verification. A completed design is checked on reliability aspects and either rejected or accepted for production. This paper describes a method to model physical failure mechanisms within components in such a way that they can be used for reliability optimization, not after, but during the early phase of the design process. Furthermore a prototype of a CAD software tool is described, which can highlight components likely to fail and automatically adjust circuit parameters to improve product reliability.
    Original languageEnglish
    Pages (from-to)267-273
    JournalQuality and reliability engineering international
    Volume7
    Issue number4
    DOIs
    Publication statusPublished - 1991

    Keywords

    • CAD
    • Reliability simulation
    • Design centring
    • Physical failure mechanisms
    • Stressor-susceptibility analysis

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