Reliability of flip chip on board - First order model for the effect on contact integrity of moisture penetration in the underfill

J.F.M.F. Caers, R. Oesterholt, R.J.L. Bresers, A.J. Mouthaan, J.F. Verweij

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    4 Citations (Scopus)
    Original languageUndefined
    Title of host publicationProceedings of the 48th ECTC
    Place of PublicationSeattle, Washington
    Number of pages6
    Publication statusPublished - 25 May 1998


    • METIS-113877

    Cite this