Reliability of flip chip on board - First order model for the effect on contact integrity of moisture penetration in the underfill

J.F.M.F. Caers, R. Oesterholt, R.J.L. Bresers, A.J. Mouthaan, J.F. Verweij

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Keywords

@inproceedings{8dfc723dd8674f649283e82bea6d3843,

title = "Reliability of flip chip on board - First order model for the effect on contact integrity of moisture penetration in the underfill",

keywords = "METIS-113877",

author = "J.F.M.F. Caers and R. Oesterholt and R.J.L. Bresers and A.J. Mouthaan and J.F. Verweij",

year = "1998",

month = may,

day = "25",

language = "Undefined",

pages = "867--871",

booktitle = "Proceedings of the 48th ECTC",

}

Reliability of flip chip on board - First order model for the effect on contact integrity of moisture penetration in the underfill. / Caers, J.F.M.F.; Oesterholt, R.; Bresers, R.J.L. et al.
Proceedings of the 48th ECTC. Seattle, Washington, 1998. p. 867-871.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Reliability of flip chip on board - First order model for the effect on contact integrity of moisture penetration in the underfill

AU - Caers, J.F.M.F.

AU - Oesterholt, R.

AU - Bresers, R.J.L.

AU - Mouthaan, A.J.

AU - Verweij, J.F.

PY - 1998/5/25

Y1 - 1998/5/25

KW - METIS-113877

M3 - Conference contribution

SP - 867

EP - 871

BT - Proceedings of the 48th ECTC

CY - Seattle, Washington

ER -