Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si3N4 Waveguides on Sapphire

Erwin Berenschot; Simen Martinussen; Kai Wang; Sonia García-Blanco; Niels Tas; Roald Tiggelaar

Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si₃N₄ Waveguides on Sapphire

Erwin Berenschot^*, Simen Martinussen, Kai Wang, Sonia García-Blanco, Niels Tas, Roald Tiggelaar

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

In this work the residual stress of various low temperature chemical vapor deposited (LPCVD) thin films on sapphire, viz. poly-silicon (poly-Si), stoichiometric silicon nitride (Si₃N₄) and silicon dioxide (SiO₂), is analyzed using profilometric curvature measurements and stress diagnostic microstructures of as-deposited as well as annealed films. The found data is used to fabricate single deposition run, 1.35 μm thick, suspended low stress Si₃N₄ waveguide on sapphire. We foresee that this platform opens the way towards new photonic systems.

Original language	English
Title of host publication	2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
Publisher	IEEE
Pages	2086-2089
Number of pages	4
ISBN (Electronic)	9784886864352
Publication status	Published - 7 May 2024
Event	22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023 - Kyoto, Japan Duration: 25 Jun 2023 → 29 Jun 2023 Conference number: 22

Conference

Conference	22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
Abbreviated title	Transducers 2023
Country/Territory	Japan
City	Kyoto
Period	25/06/23 → 29/06/23

Keywords

2024 OA procedure
Residual stress
sapphire
SiN
suspended waveguide
TEOS SiO
thin film
poly-Si

Access to Document

Residual_Stress_Analysis_of_Thin_Film_Materials_for_Fabricating_Suspended_Low_Stress_Si3N4_Waveguides_on_SapphireFinal published version, 1.67 MBLicence: Taverne

https://ieeexplore.ieee.org/document/10516852

Cite this

Berenschot, E., Martinussen, S., Wang, K., García-Blanco, S., Tas, N., & Tiggelaar, R. (2024). Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si₃N₄ Waveguides on Sapphire. In 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023 (pp. 2086-2089). IEEE. https://ieeexplore.ieee.org/document/10516852

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title = "Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si3N4 Waveguides on Sapphire",

abstract = "In this work the residual stress of various low temperature chemical vapor deposited (LPCVD) thin films on sapphire, viz. poly-silicon (poly-Si), stoichiometric silicon nitride (Si3N4) and silicon dioxide (SiO2), is analyzed using profilometric curvature measurements and stress diagnostic microstructures of as-deposited as well as annealed films. The found data is used to fabricate single deposition run, 1.35 μm thick, suspended low stress Si3N4 waveguide on sapphire. We foresee that this platform opens the way towards new photonic systems.",

keywords = "2024 OA procedure, Residual stress, sapphire, SiN, suspended waveguide, TEOS SiO, thin film, poly-Si",

author = "Erwin Berenschot and Simen Martinussen and Kai Wang and Sonia Garc{\'i}a-Blanco and Niels Tas and Roald Tiggelaar",

note = "Publisher Copyright: {\textcopyright} 2023 IEEJ.; 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023, Transducers 2023 ; Conference date: 25-06-2023 Through 29-06-2023",

year = "2024",

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booktitle = "2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023",

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Berenschot, E, Martinussen, S, Wang, K , García-Blanco, S , Tas, N & Tiggelaar, R 2024, Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si₃N₄ Waveguides on Sapphire. in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023. IEEE, pp. 2086-2089, 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023, Kyoto, Japan, 25/06/23. <https://ieeexplore.ieee.org/document/10516852>

Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si₃N₄ Waveguides on Sapphire. / Berenschot, Erwin; Martinussen, Simen; Wang, Kai et al.
2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023. IEEE, 2024. p. 2086-2089.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Residual Stress Analysis of Thin Film Materials for Fabricating Suspended Low Stress Si3N4 Waveguides on Sapphire

AU - Berenschot, Erwin

AU - Martinussen, Simen

AU - Wang, Kai

AU - García-Blanco, Sonia

AU - Tas, Niels

AU - Tiggelaar, Roald

N1 - Conference code: 22

PY - 2024/5/7

Y1 - 2024/5/7

N2 - In this work the residual stress of various low temperature chemical vapor deposited (LPCVD) thin films on sapphire, viz. poly-silicon (poly-Si), stoichiometric silicon nitride (Si3N4) and silicon dioxide (SiO2), is analyzed using profilometric curvature measurements and stress diagnostic microstructures of as-deposited as well as annealed films. The found data is used to fabricate single deposition run, 1.35 μm thick, suspended low stress Si3N4 waveguide on sapphire. We foresee that this platform opens the way towards new photonic systems.

AB - In this work the residual stress of various low temperature chemical vapor deposited (LPCVD) thin films on sapphire, viz. poly-silicon (poly-Si), stoichiometric silicon nitride (Si3N4) and silicon dioxide (SiO2), is analyzed using profilometric curvature measurements and stress diagnostic microstructures of as-deposited as well as annealed films. The found data is used to fabricate single deposition run, 1.35 μm thick, suspended low stress Si3N4 waveguide on sapphire. We foresee that this platform opens the way towards new photonic systems.

KW - 2024 OA procedure

KW - Residual stress

KW - sapphire

KW - SiN

KW - suspended waveguide

KW - TEOS SiO

KW - thin film

KW - poly-Si

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M3 - Conference contribution

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EP - 2089

BT - 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023

PB - IEEE

T2 - 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023

Y2 - 25 June 2023 through 29 June 2023

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