RFID Tag Failure after Thermal Overstress

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)
553 Downloads (Pure)


In this work the failure modes and mechanisms are investigated of a commercially available RFID tag, when it is exposed to extreme temperatures well beyond specifications. Both erroneous functioning and malfunctioning are observed after a thermal cycle exposing the tag to an elevated temperature in the 300-550 ° C range. Void formation is the dominant failure, leading to a complete malfunction of the tag. Sporadically, the RFID tag returns a wrong identification code after extreme thermal cycling. This effect is caused by relatively weak bits flipping from '1' to '0' and seems consistent with existing retention models.

Original languageEnglish
Title of host publication2019 IEEE International Integrated Reliability Workshop, IIRW 2019
ISBN (Electronic)9781728122038
ISBN (Print)978-1-7281-2204-5
Publication statusPublished - 10 Feb 2020
EventIEEE International Integrated Reliability Workshop, IIRW 2019 - South Lake Tahoe, United States
Duration: 13 Oct 201917 Oct 2019


ConferenceIEEE International Integrated Reliability Workshop, IIRW 2019
Abbreviated titleIIRW 2019
Country/TerritoryUnited States
CitySouth Lake Tahoe


  • failure
  • mission profile
  • RFID
  • temperature
  • thermal budget


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