Abstract
In this work the failure modes and mechanisms are investigated of a commercially available RFID tag, when it is exposed to extreme temperatures well beyond specifications. Both erroneous functioning and malfunctioning are observed after a thermal cycle exposing the tag to an elevated temperature in the 300-550 ° C range. Void formation is the dominant failure, leading to a complete malfunction of the tag. Sporadically, the RFID tag returns a wrong identification code after extreme thermal cycling. This effect is caused by relatively weak bits flipping from '1' to '0' and seems consistent with existing retention models.
Original language | English |
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Title of host publication | 2019 IEEE International Integrated Reliability Workshop, IIRW 2019 |
Publisher | IEEE |
ISBN (Electronic) | 9781728122038 |
ISBN (Print) | 978-1-7281-2204-5 |
DOIs | |
Publication status | Published - 10 Feb 2020 |
Event | IEEE International Integrated Reliability Workshop, IIRW 2019 - South Lake Tahoe, United States Duration: 13 Oct 2019 → 17 Oct 2019 |
Conference
Conference | IEEE International Integrated Reliability Workshop, IIRW 2019 |
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Abbreviated title | IIRW 2019 |
Country/Territory | United States |
City | South Lake Tahoe |
Period | 13/10/19 → 17/10/19 |
Keywords
- failure
- mission profile
- RFID
- temperature
- thermal budget