RFID Tag Failure after Thermal Overstress

Emre Ozturk*, Mike Jaimie Dikkers, Kevin M. Batenburg, Cora Salm, Jurriaan Schmitz

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Abstract

In this work the failure modes and mechanisms are investigated of a commercially available RFID tag, when it is exposed to extreme temperatures well beyond specifications. Both erroneous functioning and malfunctioning are observed after a thermal cycle exposing the tag to an elevated temperature in the 300-550 ° C range. Void formation is the dominant failure, leading to a complete malfunction of the tag. Sporadically, the RFID tag returns a wrong identification code after extreme thermal cycling. This effect is caused by relatively weak bits flipping from '1' to '0' and seems consistent with existing retention models.

Original languageEnglish
Title of host publication2019 IEEE International Integrated Reliability Workshop, IIRW 2019
PublisherIEEE
ISBN (Electronic)9781728122038
ISBN (Print)978-1-7281-2204-5
DOIs
Publication statusPublished - 10 Feb 2020
EventIEEE International Integrated Reliability Workshop, IIRW 2019 - South Lake Tahoe, United States
Duration: 13 Oct 201917 Oct 2019

Conference

ConferenceIEEE International Integrated Reliability Workshop, IIRW 2019
Abbreviated titleIIRW 2019
CountryUnited States
CitySouth Lake Tahoe
Period13/10/1917/10/19

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Keywords

  • failure
  • mission profile
  • RFID
  • temperature
  • thermal budget

Cite this

Ozturk, E., Dikkers, M. J., Batenburg, K. M., Salm, C., & Schmitz, J. (2020). RFID Tag Failure after Thermal Overstress. In 2019 IEEE International Integrated Reliability Workshop, IIRW 2019 [8989885] IEEE. https://doi.org/10.1109/IIRW47491.2019.8989885