Sacrificial wafer bonding: a useful tool in micromachining

V.L. Spiering; H. Berends; M.C. Elwenspoek; J.H.J. Fluitman

Sacrificial wafer bonding: a useful tool in micromachining

V.L. Spiering, H. Berends, M.C. Elwenspoek, J.H.J. Fluitman

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Sensor technology 1994
Subtitle of host publication	proceedings of the Dutch conference on sensor technology 1994, University of Twente, Enschede, the Netherlands, February 17-18, 1994
Editors	P.V. Lambeck
Place of Publication	Utrecht
Publisher	STW
Pages	329-334
ISBN (Print)	90-73461-06-5
Publication status	Published - 17 Feb 1994

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Cite this

@inproceedings{53dec4be80d0484bb27b11865fb90f80,

title = "Sacrificial wafer bonding: a useful tool in micromachining",

author = "V.L. Spiering and H. Berends and M.C. Elwenspoek and J.H.J. Fluitman",

year = "1994",

month = feb,

day = "17",

language = "English",

isbn = "90-73461-06-5",

pages = "329--334",

editor = "P.V. Lambeck",

booktitle = "Sensor technology 1994",

publisher = "STW",

}

Sacrificial wafer bonding: a useful tool in micromachining. / Spiering, V.L.; Berends, H.; Elwenspoek, M.C. et al.
Sensor technology 1994: proceedings of the Dutch conference on sensor technology 1994, University of Twente, Enschede, the Netherlands, February 17-18, 1994. ed. / P.V. Lambeck. Utrecht: STW, 1994. p. 329-334.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review