Sacrificial wafer bonding: an addition to the micromachining techniques

V.L. Spiering, J.W. Berenschot, M.C. Elwenspoek, F.J. Faase

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    21 Citations (Scopus)
    Original languageEnglish
    Title of host publicationProceedings of the Third International Symposium on Semiconductor Wafer Bonding
    Subtitle of host publicationPhysics and Applications
    EditorsC.E. Hunt
    Place of PublicationPennington, NJ
    PublisherThe Electrochemical Society Inc.
    Pages642-643
    ISBN (Print)9781566771016
    Publication statusPublished - 24 May 1995
    Event3rd International Symposium on Semiconductor Wafer Bonding 1995 - Reno, United States
    Duration: 21 May 199526 May 1995
    Conference number: 3

    Conference

    Conference3rd International Symposium on Semiconductor Wafer Bonding 1995
    CountryUnited States
    CityReno
    Period21/05/9526/05/95

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