Sacrificial wafer bonding: an addition to the micromachining techniques

V.L. Spiering; J.W. Berenschot; M.C. Elwenspoek; F.J. Faase

Sacrificial wafer bonding: an addition to the micromachining techniques

V.L. Spiering
, J.W. Berenschot
, M.C. Elwenspoek
, F.J. Faase

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the Third International Symposium on Semiconductor Wafer Bonding
Subtitle of host publication	Physics and Applications
Editors	C.E. Hunt
Place of Publication	Pennington, NJ
Publisher	Electrochemical Society
Pages	642-643
ISBN (Print)	9781566771016
Publication status	Published - 24 May 1995
Event	3rd International Symposium on Semiconductor Wafer Bonding 1995 - Reno, United States Duration: 21 May 1995 → 26 May 1995 Conference number: 3

Conference

Conference	3rd International Symposium on Semiconductor Wafer Bonding 1995
Country/Territory	United States
City	Reno
Period	21/05/95 → 26/05/95

Cite this

@inproceedings{39bf90c36b7341beba4ac708a5bcc9ca,

title = "Sacrificial wafer bonding: an addition to the micromachining techniques",

author = "V.L. Spiering and J.W. Berenschot and M.C. Elwenspoek and F.J. Faase",

year = "1995",

month = may,

day = "24",

language = "English",

isbn = "9781566771016",

pages = "642--643",

editor = "C.E. Hunt",

booktitle = "Proceedings of the Third International Symposium on Semiconductor Wafer Bonding",

publisher = "Electrochemical Society",

address = "United States",

note = "3rd International Symposium on Semiconductor Wafer Bonding 1995 ; Conference date: 21-05-1995 Through 26-05-1995",

}

Spiering, VL, Berenschot, JW, Elwenspoek, MC & Faase, FJ 1995, Sacrificial wafer bonding: an addition to the micromachining techniques. in CE Hunt (ed.), Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications. Electrochemical Society, Pennington, NJ, pp. 642-643, 3rd International Symposium on Semiconductor Wafer Bonding 1995, Reno, Nevada, United States, 21/05/95.

Sacrificial wafer bonding: an addition to the micromachining techniques. / Spiering, V.L.; Berenschot, J.W.; Elwenspoek, M.C. et al.
Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications. ed. / C.E. Hunt. Pennington, NJ: Electrochemical Society, 1995. p. 642-643.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Sacrificial wafer bonding

T2 - 3rd International Symposium on Semiconductor Wafer Bonding 1995

AU - Spiering, V.L.

AU - Berenschot, J.W.

AU - Elwenspoek, M.C.

AU - Faase, F.J.

N1 - Conference code: 3

PY - 1995/5/24

Y1 - 1995/5/24

M3 - Conference contribution

SN - 9781566771016

SP - 642

EP - 643

BT - Proceedings of the Third International Symposium on Semiconductor Wafer Bonding

A2 - Hunt, C.E.

PB - Electrochemical Society

CY - Pennington, NJ

Y2 - 21 May 1995 through 26 May 1995

ER -