"SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

B.J. Kim, G.M. Kim, M. Liebau, Jurriaan Huskens, David Reinhoudt, J.P. Brugger

Research output: Contribution to conferencePaperAcademic

2 Citations (Scopus)
76 Downloads (Pure)

Abstract

In this contribution we demonstrate the use of self-assembled monolayers (SAMs) as anti-adhesion coating to assist the removal of photoplastic MEMS/NEMS with a patterned metal layer from the surface without wet chemical sacrificial layer etching, so-called 'dry-demolding'. The SAMs functionality here is to reduce the stiction between the surface and a thin evaporated metal film. The double-layer SAM/metal provides enough stability to support subsequent micromachining steps
Original languageUndefined
Pages106-109
DOIs
Publication statusPublished - 2001
Event14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001 - Interlaken, Switzerland
Duration: 21 Jan 200125 Jan 2001
Conference number: 14

Conference

Conference14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001
Abbreviated titleMEMS
CountrySwitzerland
CityInterlaken
Period21/01/0125/01/01

Keywords

  • IR-55916

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