"SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

B.J. Kim; G.M. Kim; M. Liebau; Jurriaan Huskens; David Reinhoudt; J.P. Brugger

doi:10.1109/MEMSYS.2001.906490

"SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

B.J. Kim, G.M. Kim, M. Liebau, Jurriaan Huskens, David Reinhoudt, J.P. Brugger

Research output: Contribution to conference › Paper

2 Citations (Scopus)

217 Downloads (Pure)

Abstract

In this contribution we demonstrate the use of self-assembled monolayers (SAMs) as anti-adhesion coating to assist the removal of photoplastic MEMS/NEMS with a patterned metal layer from the surface without wet chemical sacrificial layer etching, so-called 'dry-demolding'. The SAMs functionality here is to reduce the stiction between the surface and a thin evaporated metal film. The double-layer SAM/metal provides enough stability to support subsequent micromachining steps

Original language	Undefined
Pages	106-109
DOIs	https://doi.org/10.1109/MEMSYS.2001.906490
Publication status	Published - 2001
Event	14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001 - Interlaken, Switzerland Duration: 21 Jan 2001 → 25 Jan 2001 Conference number: 14

Conference

Conference	14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001
Abbreviated title	MEMS
Country/Territory	Switzerland
City	Interlaken
Period	21/01/01 → 25/01/01

Keywords

IR-55916

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/MEMSYS.2001.906490

00906490

Cite this

Kim, B. J., Kim, G. M., Liebau, M., Huskens, J., Reinhoudt, D., & Brugger, J. P. (2001). "SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS. 106-109. Paper presented at 14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001, Interlaken, Switzerland. https://doi.org/10.1109/MEMSYS.2001.906490

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abstract = "In this contribution we demonstrate the use of self-assembled monolayers (SAMs) as anti-adhesion coating to assist the removal of photoplastic MEMS/NEMS with a patterned metal layer from the surface without wet chemical sacrificial layer etching, so-called 'dry-demolding'. The SAMs functionality here is to reduce the stiction between the surface and a thin evaporated metal film. The double-layer SAM/metal provides enough stability to support subsequent micromachining steps",

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Kim, BJ, Kim, GM, Liebau, M, Huskens, J , Reinhoudt, D & Brugger, JP 2001, '"SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS', Paper presented at 14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001, Interlaken, Switzerland, 21/01/01 - 25/01/01 pp. 106-109. https://doi.org/10.1109/MEMSYS.2001.906490

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AU - Kim, B.J.

AU - Kim, G.M.

AU - Liebau, M.

AU - Huskens, Jurriaan

AU - Reinhoudt, David

AU - Brugger, J.P.

N1 - Conference code: 14

PY - 2001

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AB - In this contribution we demonstrate the use of self-assembled monolayers (SAMs) as anti-adhesion coating to assist the removal of photoplastic MEMS/NEMS with a patterned metal layer from the surface without wet chemical sacrificial layer etching, so-called 'dry-demolding'. The SAMs functionality here is to reduce the stiction between the surface and a thin evaporated metal film. The double-layer SAM/metal provides enough stability to support subsequent micromachining steps

KW - IR-55916

U2 - 10.1109/MEMSYS.2001.906490

DO - 10.1109/MEMSYS.2001.906490

M3 - Paper

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EP - 109

T2 - 14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001

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