Selecting capillary structures for heat pipes in multilayer printed circuit boards

W.W. Wits, R. Legtenberg, J.H. Mannak

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    Heat pipes are increasingly used to manage heat dissipations in electronic products. In a novel design approach for these products, a flat miniature heat pipe has been integrated inside the laminated structure of a printed circuit board (PCB). The capillary wick structure, required to facilitate the fluid transport, in combination with the orientation of the embedded heat pipe determines, to a large extent, the heat pipe's performance. Important design parameters are the wick's effective pore size and permeability, together with production and assembly requirements. A narrow pore gives great capillary pressure, however more friction is encountered. In general, as the gravitation assisted fluid flow decreases, so does the design freedom to select a type of wick. For gravity assisted orientations an open wick structure, such as microgrooves, channels and arteries, is preferred, whereas against gravity a more compact wick, for instance a sintered metal wick, is required. The optimal capillary structure should be selected for the intended application and production volume, thus obtaining sufficient heat transport, at the lowest manufacturing cost.
    Original languageEnglish
    Title of host publicationProceedings 5th European Thermal-Sciences Conference (Eurotherm 2008)
    EditorsG.G.M. Stoffels, T.H. van der Meer, A.A. van Steenhoven
    Place of PublicationEindhoven
    PublisherEindhoven University of Technology
    Number of pages8
    ISBN (Print)9789038612744
    Publication statusPublished - 18 May 2008
    Event5th European Thermal-Sciences Conference, Eurotherm 2008 - Eindhoven, Netherlands
    Duration: 18 May 200822 May 2008
    Conference number: 5


    Conference5th European Thermal-Sciences Conference, Eurotherm 2008
    Abbreviated titleEurotherm


    • METIS-255772

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