Selective Wafer Bonding by Surface Roughness Control

C. Gui, R.E. Oosterbroek, Johan W. Berenschot, Stefan Schlautmann, Theodorus S.J. Lammerink, Albert van den Berg, Michael Curt Elwenspoek

    Research output: Contribution to journalArticleAcademicpeer-review

    6 Citations (Scopus)
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