Selective Wafer Bonding by Surface Roughness Control

C. Gui, R.E. Oosterbroek, J.W. Berenschot, S. Schlautmann, T.S.J. Lammerink, A. van den Berg, M.C. Elwenspoek

    Research output: Contribution to journal › Article › Academic › peer-review

    6 Citations (Scopus)
    10 Downloads (Pure)

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    Engineering