TY - GEN
T1 - Self-Aligned Fabrication and Contact Line Pinning Characterization of Pedestal Nozzles
AU - Borgelink, Bjorn T.H.
AU - Berenschot, Erwin J.W.
AU - Sanders, Remco G.P.
AU - Schlautmann, Stefan
AU - Gardeniers, Han
AU - Tas, Niels R.
N1 - Funding Information:
B.T.H.B. highly appreciated the help of Jelle Schoppink with setting up the high-speed camera. B.T.H.B., E.J.W.B., H.G. and N.R.T received funding from the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation program (grant agreement no. 742004).
Publisher Copyright:
© 2022 IEEE.
PY - 2022/2/11
Y1 - 2022/2/11
N2 - Silicon dioxide pedestal nozzles are introduced, featuring a sharp concentric rim with an edge angle of approximately 5° and a sub-20 nm radius of curvature. The nozzles show an unprecedented ability to pin the contact line of de-ionized water, and apparent contact angles exceeding 210° were observed. A dynamic contact angle characterization method is introduced to determine the pinning capabilities of the nozzle. The nozzle is vibrated with a piezo actuator and brings pendant droplets close to their resonance frequency. Larger contact angles are observed for smaller droplets, because they can be driven closer to the resonance frequency before pinch-off.
AB - Silicon dioxide pedestal nozzles are introduced, featuring a sharp concentric rim with an edge angle of approximately 5° and a sub-20 nm radius of curvature. The nozzles show an unprecedented ability to pin the contact line of de-ionized water, and apparent contact angles exceeding 210° were observed. A dynamic contact angle characterization method is introduced to determine the pinning capabilities of the nozzle. The nozzle is vibrated with a piezo actuator and brings pendant droplets close to their resonance frequency. Larger contact angles are observed for smaller droplets, because they can be driven closer to the resonance frequency before pinch-off.
KW - contact line pinning
KW - droplet
KW - microfluidics
KW - Micronozzle
KW - silicon machining
KW - 22/4 OA procedure
UR - http://www.scopus.com/inward/record.url?scp=85126395214&partnerID=8YFLogxK
U2 - 10.1109/MEMS51670.2022.9699536
DO - 10.1109/MEMS51670.2022.9699536
M3 - Conference contribution
AN - SCOPUS:85126395214
T3 - IEEE Symposium on Mass Storage Systems and Technologies
SP - 259
EP - 262
BT - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PB - IEEE
T2 - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Y2 - 9 January 2022 through 13 January 2022
ER -