Semi-analytic approximation of the temperature field resulting from moving heat loads

D.W.M. Veldman; R.H.B. Fey; H.J. Zwart; M.M.J. van de Wal; J.D.B.J. van den Boom; H. Nijmeijer

doi:10.1016/j.ijheatmasstransfer.2018.01.085

Semi-analytic approximation of the temperature field resulting from moving heat loads

D.W.M. Veldman (Corresponding Author), R.H.B. Fey, H.J. Zwart, M.M.J. van de Wal, J.D.B.J. van den Boom, H. Nijmeijer

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Abstract

Moving heat load problems appear in many manufacturing processes, such as lithography, welding, grinding, and additive manufacturing. The simulation of moving heat load problems by the finite-element method poses several numerical challenges, which may lead to time consuming computations. In this paper, we propose a 2D semi-analytic model in which the problem in two spatial dimensions is decoupled into three problems in one spatial dimension. This decoupling significantly reduces the computational time, but also introduces an additional error. The method is applied to a wafer heating example, in which the computational time is reduced by a factor 10 at the cost of a 4% error in the temperature field.

Original language	English
Pages (from-to)	128-137
Number of pages	10
Journal	International journal of heat and mass transfer
Volume	122
DOIs	https://doi.org/10.1016/j.ijheatmasstransfer.2018.01.085
Publication status	Published - 1 Jul 2018

Keywords

UT-Hybrid-D
Moving heat source
Wafer heating
Finite elements

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1016/j.ijheatmasstransfer.2018.01.085Licence: CC BY

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Cite this

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AU - van den Boom, J.D.B.J.

AU - Nijmeijer, H.

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AB - Moving heat load problems appear in many manufacturing processes, such as lithography, welding, grinding, and additive manufacturing. The simulation of moving heat load problems by the finite-element method poses several numerical challenges, which may lead to time consuming computations. In this paper, we propose a 2D semi-analytic model in which the problem in two spatial dimensions is decoupled into three problems in one spatial dimension. This decoupling significantly reduces the computational time, but also introduces an additional error. The method is applied to a wafer heating example, in which the computational time is reduced by a factor 10 at the cost of a 4% error in the temperature field.

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Semi-analytic approximation of the temperature field resulting from moving heat loads

Abstract

Keywords

UN SDGs

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