Abstract
This paper presents a wafer scale fabrication method of single-crystalline silicon nanowires (SiNWs) bound by <111> planes using a combination of edge and corner lithography. These are methods of unconventional nanolithography for wafer scale nano-patterning which determine the size of nano-features to the formed. The pattern formed by conventional microlithography determines the location. The presented method is based on the low etch rate of <111>-planes. Initially, using edge lithography, nanoridges with ∼71° angle with the wafer surface and bound by <111>-planes are fabricated. Thereafter, corner lithography is used. The fabricated SiNWs can be isolated from the substrate by oxidation of the thin silicon base.
| Original language | Undefined |
|---|---|
| Title of host publication | IEEE Nanotechnology Materials and Devices Conference, NMDC 2010 |
| Place of Publication | Monterey |
| Publisher | IEEE |
| Pages | 128-131 |
| Number of pages | 4 |
| ISBN (Print) | 978-1-4244-8896-4 |
| DOIs | |
| Publication status | Published - 12 Oct 2010 |
| Event | IEEE Nanotechnology Materials and Devices Conference, NMDC 2010, Monterey, CA, USA: IEEE Nanotechnology Materials and Devices Conference, NMDC 2010 - Monterey Duration: 12 Oct 2010 → … |
Publication series
| Name | |
|---|---|
| Publisher | IEEE |
Conference
| Conference | IEEE Nanotechnology Materials and Devices Conference, NMDC 2010, Monterey, CA, USA |
|---|---|
| City | Monterey |
| Period | 12/10/10 → … |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Keywords
- IR-75032
- EWI-18565
- METIS-275667
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